证券代码：688403 证券简称：汇成股份 公告编号：2025-045 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司 关于"汇成转债"2025 年付息的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 合肥新汇成微电子股份有限公司（以下简称"公司"或"本公司"）于 2024 年 8 月 7 日发行的可转换公司债券将于 2025 年 8 月 7 日开始支付自 2024 年 8 月 7 日至 2025 年 8 月 6 日期间的利息。根据《合肥新汇成微电子股份有限公司向不特定对象发 行可转换公司债券募集说明书》（以下简称"《募集说明书》"）有关规定，现将有关事 项公告如下： 一、可转债基本情况 （一）发行上市概况 根据相关法律法规规定及《募集说明书》的约定，"汇成转债"自 2025 年 2 月 13 日起可转换为公司股份，初始转股价格为 7.70 元/股。 因实施 2024 年年度权益分派，"汇成转债"转股价格由 7.70 元/股调整为 7.61 元/ 股，调整后的转股价格于 20 ...

证券代码：688403 证券简称：汇成股份 公告编号：2025-044 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司 关于不提前赎回"汇成转债"的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、可转债的基本情况 （一）可转债的发行情况 根据中国证券监督管理委员会出具的《关于同意合肥新汇成微电子股份有限公司 向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕883 号），公司获准 于 2024 年 8 月 7 日向不特定对象发行 11,487,000 张可转换公司债券，每张面值为人民 币 100.00 元，按面值发行，发行总额 114,870.00 万元。本次发行的可转换公司债券的 期限为自发行之日起六年，即自 2024 年 8 月 7 日起，至 2030 年 8 月 6 日止，票面利率 1 / 4 为第一年 0.20%、第二年 0.40%、第三年 0.60%、第四年 1.50%、第五年 1.80%、第六 年 2.00%。 （二）可转债的上市情况 重要内容提示： 合肥新汇成 ...

国泰海通证券股份有限公司 关于合肥新汇成微电子股份有限公司 不提前赎回汇成转债的专项核查意见 国泰海通证券股份有限公司（以下简称"国泰海通"或"保荐机构"）作为 合肥新汇成微电子股份有限公司（以下简称"汇成股份"或"公司"）首次公开 发行股票并上市及向不特定对象发行可转换公司债券的持续督导保荐机构，根据 《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》《可 转换公司债券管理办法》和《上海证券交易所上市公司自律监管指引第 12 号— —可转换公司债券》等有关规定，对公司不提前赎回汇成转债的事项进行了核查， 核查情况及核查意见如下： 一、可转换公司债券的基本情况 （一）可转换公司债券的发行情况 根据中国证券监督管理委员会出具的《关于同意合肥新汇成微电子股份有限 公司向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕883 号）， 公司获准于 2024 年 8 月 7 日向不特定对象发行 11,487,000 张可转换公司债券， 每张面值为人民币 100.00 元，按面值发行，发行总额 114,870.00 万元。本次发 行的可转换公司债券的期限为自发行之日起六年，即自 2024 ...

7月28日，由影石与第三方共同孵化的消费级无人机品牌"影翎Antigravity"及品牌标识官宣亮相，计划推 出全新品类——全球首款全景无人机。根据品牌官网公布的信息，其首款全景无人机可拍摄8K全景视 频，机身重量小于249g，产品形态将于8月亮相。 这一消息引发广泛关注，消费级航拍无人机市场或将迎来颠覆性飞行体验。据介绍，影翎Antigravity的 团队核心成员来自全球领先的影像、科技公司，拥有丰富的行业经验。据相关负责人透露，即将推出的 新品具有极简、智能化的飞行操控，以及带给用户沉浸式自由飞行的体验，"仿佛在天空中飞翔。" 事实上，消费级无人机发展经历近20年，已经是一个成熟的品类，近年来参数升级迭代更是达到了一个 新高度，而大疆在全球消费级无人机市场更是处于绝对的统治地位。不过，今年6月上市的科创板新贵 影石创新，向大疆领导下的消费级无人机市场发起了挑战。 影翎Antigravity相关负责人表示："我们的终极梦想是创造一个全新的无人机品类和市场"。 在品牌官宣后，影石Insta360创始人兼董事长刘靖康在朋友圈发文称，公司做无人机的起心动念有三： 一是公司的使命愿景驱动；二是看到有大量的客户需求未 ...

Core Viewpoint - The announcement details the completion of the first grant of the 2023 Restricted Stock Incentive Plan by Hefei Xinhui Microelectronics Co., Ltd, including the stock listing and allocation details for the incentive shares [2][10]. Group 1: Incentive Plan Overview - The stock listing type is for equity incentive shares, with a total of 2,234,000 shares to be listed on July 30, 2025 [2]. - The first vesting date for the incentive shares is set for July 23, 2025 [2][10]. - The incentive plan was approved by the board on May 29, 2023, and the independent directors expressed their agreement [3][4]. Group 2: Decision-Making Process - The plan underwent a series of approvals, including verification by the supervisory board and public disclosure on the Shanghai Stock Exchange [3][4][5]. - The company conducted a self-examination regarding insider trading prior to the announcement of the incentive plan, finding no violations [5]. Group 3: Allocation Details - The allocation includes 64 recipients, with a total of 2,234,000 shares being vested [8][9]. - The allocation for senior management and core technical personnel includes specific numbers of shares for individuals, with percentages of shares vested [7][8]. Group 4: Impact on Share Capital - Following the vesting, the total share capital will increase from 837,984,074 shares to 840,218,074 shares [8][9]. - The shareholding ratio of the controlling shareholder and their concerted actors will be diluted from 31.0094% to 30.9933% due to the increase in total shares [9]. Group 5: Financial Impact - The completion of the stock vesting will dilute the earnings per share based on the first quarter report of 2025, which showed a net profit of approximately 40.59 million yuan [10].

Core Viewpoint - The company announced that the conversion price of "Hui Cheng Convertible Bonds" will remain unchanged at 7.61 yuan per share after the completion of the restricted stock vesting [1][2]. Group 1: Conversion Price Details - The conversion price before the completion of the restricted stock vesting is 7.61 yuan per share [1]. - The conversion price after the completion of the restricted stock vesting is also 7.61 yuan per share [1]. - The total number of shares vested from the 2023 restricted stock incentive plan is 2,234,000 shares, which is a small proportion of the company's total share capital [1][2]. Group 2: Adjustment Basis and Calculation - The adjustment of the conversion price is based on the issuance terms outlined in the "Offering Circular" [2]. - The formula for adjusting the conversion price in case of new share issuance or rights issue is provided, where P1 is the adjusted conversion price, P0 is the pre-adjustment price, A is the new share price, and k is the issuance rate [2]. - The calculation shows that the conversion price remains approximately 7.61 yuan per share after applying the adjustment formula, confirming no change in the conversion price [2]. Group 3: Additional Information - Investors seeking detailed information about "Hui Cheng Convertible Bonds" can refer to the "Offering Circular" disclosed on August 5, 2024 [3]. - Contact information for the company's board office is provided for further inquiries [3].

证券代码：688403 证券简称：汇成股份 公告编号：2025-043 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司 关于限制性股票归属完成后 因合肥新汇成微电子股份有限公司（以下简称"公司"或"本公司"）2023 年 限制性股票激励计划首次授予第二个归属期及预留授予第一个归属期归属的股票总数 占公司总股本的比例较小，经计算并四舍五入，本次归属完成后，"汇成转债"转股价 格不变。 一、转股价格调整依据 公司于 2025 年 7 月 23 日完成了 2023 年限制性股票激励计划首次授予第二个归属 期及预留授予第一个归属期归属股票的登记手续，归属股票数量为 2,234,000 股，归属 股票来源为公司向激励对象定向发行本公司人民币普通股股票。具体内容详见公司于 2025 年 7 月 25 日在上海证券交易所网站（www.sse.com.cn）披露的《2023 年限制性股 票激励计划首次授予第二个归属期及预留授予第一个归属期归属结果暨股票上市公告》 （公告编号：2025-042）。 根据《合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券募集说 明书》（以下简称"《募集说明书》 ...

转债代码:118049 转债简称:汇成转债 证券代码:688403 证券简称:汇成股份 公告编号：2025-042 合肥新汇成微电子股份有限公司 2023 年限制性股票激励计划首次授予第二个归属期及 预留授予第一个归属期归属结果暨股票上市公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次股票上市类型为股权激励股份；股票认购方式为网下，上市股数为 2,234,000股。 本次股票上市流通总数为2,234,000股。 本次股票上市流通日期为2025 年 7 月 30 日。 合肥新汇成微电子股份有限公司（以下简称"公司"或"本公司"）于近日 收到中国证券登记结算有限责任公司上海分公司出具的《证券变更登记证明》， 公司完成了 2023 年限制性股票激励计划（以下简称"激励计划"）首次授予第二 个归属期及预留授予第一个归属期归属股票归属和登记工作，归属日为 2025 年 7 月 23 日。现将有关情况公告如下： 一、激励计划已履行的决策程序和信息披露情况 （一）2023 年 5 月 29 日，公司召开的第一届 ...

Core Viewpoint - The semiconductor industry is experiencing a significant upward trend, particularly in the photolithography equipment sector, with companies like Dongfang Jiasheng reaching their daily limit increase in stock price [1] Group 1: Market Performance - The semiconductor supply chain saw a notable rise, with Dongfang Jiasheng hitting the daily limit increase and other companies such as Maolai Optics and Zhongying Electronics rising nearly 10% [1] - Other companies in the sector, including Huicheng Vacuum, Shanghai Xinyang, Huahong Company, Kaimeteqi, and SMIC, also experienced stock price increases [1] Group 2: Industry Forecast - SEMI (Semiconductor Equipment and Materials International) predicts that the total sales of semiconductor manufacturing equipment by original equipment manufacturers (OEMs) will reach a record high of $125.5 billion by 2025, representing a year-on-year growth of 7.4% [1]

Core Viewpoint - The handheld smart imaging device market is rapidly growing, driven by differentiated innovations from brands like GoPro, Insta360, and DJI, as well as the increasing consumer demand for "recording life" experiences [1][3]. Market Overview - The global handheld smart imaging device market is approaching a scale of 60 billion yuan, with GoPro, Insta360, and DJI dominating the market. The market is characterized by portability, diverse shooting methods, and low usage barriers, primarily divided into action cameras and panoramic cameras [3][7]. - In 2023, the global smart action camera market is valued at 31.4 billion yuan, while the mobile panoramic camera market is at 5 billion yuan. By 2027, these figures are expected to reach 51.4 billion yuan and 7.9 billion yuan, respectively [3][13][19]. Industry Dynamics - The emergence of the "recording life" demand and the expansion of application scenarios are key to manufacturers' differentiation. Handheld smart imaging devices are expected to become essential accessories for smartphones, similar to smartwatches and TWS earbuds [3][31]. - The market is projected to see a shipment volume exceeding 100 million units in the long term, driven by both outdoor sports enthusiasts and vlog users [34][35]. Competitive Landscape - The action camera market is led by GoPro and DJI in the mid-to-high-end segment, while the entry-level market is dominated by white-label manufacturers. Insta360 holds a significant share in the panoramic camera market [3][16][21]. - GoPro's decline is attributed to internal factors such as a shift in focus and slowed innovation, as well as external competition from brands like DJI and Insta360 [39][40][44]. Supply Chain Insights - The supply chain for handheld smart imaging devices primarily consists of SoC/DSP and optical modules, with software developed in-house by manufacturers. The cost structure indicates that SoC/DSP accounts for approximately 33% and optical modules for 27% of the total material costs [4][55]. - The optical module market is expected to maintain higher profit margins compared to the smartphone sector, with key suppliers including domestic companies [59]. Future Outlook - The market for handheld smart imaging devices is anticipated to grow significantly, with a potential shipment volume of 140 million units in the long term. This growth is supported by the increasing number of outdoor sports enthusiasts and the rising popularity of short video content creation [34][35][36]. - The industry is characterized as a "shallow sea market," where differentiation can help maintain high profit margins despite increasing competition [49].