Tianshui Huatian Technology (002185) 每日经济新闻·2025-04-01 15:12Group 1: Company Developments - Huatian Technology (华天科技) reported its 2024 annual report, highlighting ongoing research and development in advanced packaging technologies, particularly focusing on Chiplet, automotive electronics, and board-level packaging [1] - The company has completed the construction and equipment debugging of its 2.5D production line, which is crucial for mainstream computing chips [1] - Huatian's R&D investment aims to develop 2.5D packaging technology for applications in AI, big data, and high-performance computing, with a goal to increase market share [1] Group 2: Industry Trends - Changdian Technology (长电科技) is also investing in 2.5D packaging technology, with its XDFOI®Chiplet series entering stable mass production [2] - This technology focuses on high-density heterogeneous integration solutions, covering 2D, 2.5D, and 3D integration technologies, indicating a trend towards collaborative design and integrated testing [2] - Both Huatian and Changdian are prioritizing R&D in high-performance computing 2.5D advanced packaging, while Tongfu Microelectronics (通富微电) has not reported similar projects in its 2023 annual report [3] Group 3: Competitive Landscape - Tongfu Microelectronics is upgrading its large-size multi-chip Chiplet packaging technology, developing new processes to enhance chip reliability, although it lacks a focus on 2.5D packaging [3] - The competitive landscape shows a clear focus among leading companies on advanced packaging technologies, particularly in the context of high-performance computing and AI applications [2][3]