Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025

Core Insights - Broadcom is expanding its optical interconnect solutions to support AI infrastructure, showcasing advancements at the 2025 Optical Fiber Communications Conference [1][2][3] - The company aims to address the increasing demands for higher bandwidth, lower latency, and power efficiency in AI workloads, with a roadmap towards 200T optical interconnect solutions [2][3] Product Innovations - Introduction of XPU-CPO, a 6.4-Tbps optics attach for custom AI accelerators, enabling high bandwidth and long reach connectivity for AI servers [4] - Launch of Sian3, a 3nm 200G/lane DSP that delivers the lowest power consumption in the industry for 800G and 1.6T optical transceivers [4] - Development of 200G/lane Lasers and 400G EML technologies to facilitate high-speed interconnects for large-scale AI clusters [4] - Demonstration of PCIe Gen6 over optics, enhancing connectivity between AI accelerators and system components [4] Industry Collaboration and Events - Broadcom is collaborating with over 15 partners to showcase its solutions at the OFC, emphasizing its commitment to advancing optical networking technologies [3][6] - The conference features various technical sessions addressing challenges and advancements in optical interconnects, including topics on cost optimization and the evolution from copper to optical [5][6] Company Overview - Broadcom Inc. is a global technology leader in semiconductor and enterprise software solutions, serving critical markets such as cloud, data center, and networking [7]