STMicroelectronics details company-wide program to reshape manufacturing footprint and resize global cost base

Core Viewpoint - STMicroelectronics is reshaping its global manufacturing footprint and resizing its cost base to enhance competitiveness and ensure long-term sustainability as an Integrated Device Manufacturer [2][3]. Manufacturing Strategy - The company aims to accelerate the delivery of innovative technologies and products at scale across various applications, including automotive and industrial sectors [4]. - Planned investments will focus on future-ready infrastructure, including 300mm silicon and 200mm silicon carbide wafer fabs, while maximizing productivity of legacy 150mm and mature 200mm capabilities [5]. Ecosystem Strengthening - Over the next three years, ST will design and strengthen its manufacturing ecosystems in France, Italy, and Singapore, focusing on digital, analog, power technologies, and mature technologies respectively [6]. Capacity Expansion Plans - The Agrate (Italy) 300mm fab aims to double its capacity to 4,000 wafers per week by 2027, with potential expansions up to 14,000 wafers per week [7]. - The Crolles (France) 300mm fab plans to increase capacity to 14,000 wafers per week by 2027, with modular expansions potentially reaching 20,000 wafers per week [9]. Specialized Manufacturing Centers - Catania will serve as a center of excellence for power and wide-bandgap semiconductor devices, with production of 200mm wafers set to begin in Q4 2025 [10]. - Other sites, such as Rousset and Tours in France, will focus on optimizing existing manufacturing capacities and introducing new technologies like panel-level-packaging [11][12]. Workforce Evolution - The restructuring will lead to an expected voluntary departure of up to 2,800 employees globally over three years, with a shift in skill sets towards automation and process control [14].