传华为昇腾920下半年发布 实现对英伟达H20的国产替代

Core Viewpoint - Huawei is set to launch its next-generation AI semiconductor, Ascend 920, in the second half of 2025, with mass production starting in the second half of this year, aiming to fill the gap left by NVIDIA's H20 chip due to recent U.S. export restrictions [1][2] Group 1: Market Context - The U.S. Department of Commerce has announced new export licensing requirements for NVIDIA H20, AMD MI308, and similar chips to China, making the export restrictions indefinite [1] - China is a key market for the H20 chip, and the restrictions are expected to impact the availability of these AI chips in the region [1] Group 2: Product Specifications - The Ascend 920 chip will be manufactured using SMIC's 6nm (N+3 node) process technology [2] - It is expected to deliver 900 TFLOPS of BF16 computing power and 4000 GB/s memory bandwidth, leveraging HBM3 memory modules [2] - The architecture continues from the Ascend 910C, with a training efficiency improvement of 30%-40%, potentially surpassing NVIDIA's H20 performance [2] - The chip supports PCIe 5.0 and next-generation high-throughput interconnect protocols, optimizing resource scheduling and cross-node collaboration [2] - Enhanced tensor operation accelerators are included, optimized for Transformer and MoE models to meet the demands of larger and more complex model training [2]