Core Insights - Intel is making significant strides in the smart automotive sector, emphasizing the importance of the Chinese market and aiming to become a key player in the industry [1][17] - The company has launched a new strategy by partnering with Black Sesame Intelligence to create a cockpit and driving integration platform, which combines Intel's SoC with Black Sesame's chip families [2][3] - Intel's second-generation cockpit SoC, set for mass production in 2026, features a chiplet architecture that allows for cost-effective and customizable solutions for automotive manufacturers [5][15] Market Position and Strategy - Intel's entry into the automotive market comes amid strong competition from Qualcomm and NVIDIA, which dominate the smart cockpit and driving chip markets [1] - The partnership with Black Sesame aims to address the growing demand for advanced driver-assistance systems (ADAS) and cockpit solutions, with plans to release a reference design in Q2 of this year [3][4] - The company is open to collaborating with any ADAS manufacturer, not just Black Sesame, to enhance its market presence [2][8] Product Development - The latest cockpit SoC showcases a performance increase of up to 10 times for generative and multimodal AI capabilities and up to 3 times for graphics performance compared to the previous generation [4] - The chiplet architecture allows for different manufacturing processes to be used in various parts of the chip, optimizing costs and performance [4][15] - Intel is also focusing on domain controllers, aiming to reduce the number of electronic control units (ECUs) in vehicles through software-defined architecture, which could streamline operations and reduce costs [6][10] Future Outlook - The automotive business is viewed as a growth opportunity for Intel, leveraging its existing investments in AI and PC technologies to enhance automotive applications [16][17] - The company aims to transform the automotive industry by applying its data center experience to create a software-defined vehicle architecture, which could significantly change how automotive systems are integrated and managed [12][13]
与黑芝麻智能合作,英特尔瞄准下一代智能座舱芯片|36氪专访