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2025汽车半导体生态大会 | 均联智行胡哲奇:始终与市场保持同频,座舱域控及融合芯片国产化趋势显现
Zhong Guo Qi Che Bao Wang·2025-04-26 11:50

Group 1 - The "2025 Automotive Semiconductor Ecological Conference and China Automotive Chip Technology Roadshow" was held on April 25-26, 2025, in Shanghai, aiming to create a top platform for global automotive semiconductor industry elites to exchange and showcase achievements [1] - The conference highlighted the trend of domestic chip localization in the context of trade decoupling and geopolitical influences, particularly in the smart cockpit domain [1][3] - Junlian Zhixing Technology Co., Ltd. has extensive experience serving global OEMs, with product solutions covering smart cockpit, smart driving, body and safety, and intelligent networking [3] Group 2 - The relationship between Junlian Zhixing's product lines and SoC chips is significant, with Qualcomm being a key partner for smart cockpit deliveries [3] - Domestic manufacturers are beginning to replace some functionalities in power management and communication interface chips, although widespread application is still dominated by international companies [4][6] - The complexity of chip applications is categorized into four levels, with the first level being less complex and easier to implement, while the fourth level involves high complexity and significant software ecosystem dependencies [6] Group 3 - The competitive landscape in the smart technology sector is intense, and the company aims to foster long-term collaborations through resource sharing and complementary advantages [7] - The focus is on joint product development, solution integration, and business expansion with ecosystem partners to provide more competitive solutions and drive innovation [7]