NavInfo(SZ:002405) Huan Qiu Wang·2025-04-27 07:38Core Insights - Beijing Four-Dimensional Map Technology Co., Ltd. and Shenzhen Hangseng Electronics Co., Ltd. signed a strategic cooperation agreement during the 20th Shanghai International Automobile Industry Exhibition, marking the first full-chain collaborative innovation in the domestic automotive electronics sector between a map provider and a Tier 1 supplier [1] Technical Collaboration - The two companies will collaborate in three core areas: 1. Joint chip development focusing on next-generation smart cockpit and ADAS dedicated chip architecture [3] 2. Optimization of ADAS systems by integrating high-precision positioning technology with existing ADAS control units to support L2+ level autonomous driving [3] 3. Upgrading smart cockpits by deploying AI large models in vehicle scenarios, achieving a voice command response time of 0.8 seconds [3] Manufacturing Support - Hangseng's digital factory in Shenzhen, with an annual production capacity of 3 million vehicle-mounted systems, will provide flexible production support for Four-Dimensional Map Technology [3] - The companies plan to establish a joint laboratory to enhance the reliability verification of automotive-grade products, targeting a Mean Time Between Failures (MTBF) of 50,000 hours [3] Industry Growth Potential - The technology areas involved in this cooperation are experiencing rapid growth, with the Chinese smart cockpit market projected to reach 120 billion yuan in 2024 and L2 level autonomous driving installation rates exceeding 45% [4] - The collaboration aims to complete 10 model projects by 2026, covering pure electric, hybrid, and fuel-powered platforms [4] Project Launch - The first cooperative project is set to commence in the third quarter, focusing on the development of a smart cockpit system for a high-end electric vehicle from a domestic brand [5]