Intel(US:INTC) Xin Lang Ke Ji·2025-04-30 01:02Core Insights - Intel shared advancements in multi-generation core processes and advanced packaging technologies at the 2025 Intel Foundry Direct Connect conference [1] - The company announced new ecosystem projects and partnerships to enhance its foundry services [1] Process Technology - Intel Foundry has collaborated with major clients on the Intel 14A process technology, sending early versions of the Intel 14A Process Design Kit (PDK) for testing chip manufacturing [1] - Intel 14A will utilize PowerDirect direct contact power technology, contrasting with the PowerVia back-side power technology used in Intel 18A [1] - Intel 18A has entered risk production and is expected to achieve volume manufacturing within the year [1] - Ecosystem partners are providing EDA support, reference flows, and IP licensing for Intel 18A, enabling clients to begin product design [1] Advanced Versions - The evolution of the Intel 18A process node, known as Intel 18A-P, is now in early wafer production, offering superior performance to a broader range of foundry customers [2] - Intel 18A-P is compatible with Intel 18A design rules, allowing IP and EDA partners to support this evolution [2] - Intel 18A-PT, another evolution of Intel 18A, enhances performance and energy efficiency, utilizing Foveros Direct 3D advanced packaging technology with interconnect spacing of less than 5 micrometers [2] Collaboration and Production - The first products based on the 16nm process have entered wafer production at Intel Foundry [2] - Intel is in discussions with major clients regarding the development of a 12nm node and its evolution in collaboration with UMC [2] - Intel's CEO emphasized the commitment to building a world-class foundry to meet the growing demand for cutting-edge process technologies and advanced manufacturing solutions [2]