不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 11月26日消息，台积电正式宣布，已向台湾地区法院提起诉讼， 控告其前资深副总经理罗唯仁违反竞业禁止约定，并可能泄露公司营业 秘密及机密资讯给竞争对手Intel！ 罗唯仁自2004年7月起在台积电任职，一路晋升至资深副总经理，于今年7月27日正式退休，服务时间长达21年，然而他离职后立即加入 了Intel，担任执行副总裁一职。 随后本月有消息称，罗唯仁在退休前利用高级主管职权，要求员工制作并携带有关于台积电2nm及A16、A14等先进工艺的技术简报。 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 半导体论坛百万微信群 台积电指出，诉讼是基于双方签署的聘雇合约、竞业禁止同意书以及《营业秘密法》等规定，罗唯仁在职期间曾签署保密及离职后的竞 业禁止条款。 台积电表示 ，在罗唯仁今年3月被调任至企业策略发展部（幕僚单位，职能上不再监督研发部门）后，他仍要求研发部门召开会议并提供 资料，以了解正在研发中以及未来规划的先进制程技术。 更关键的是，台积电在今年7月22日进行离职面谈时，罗唯仁明确表示离职后将前往学术机构任职，完全没有提及将转投Intel。 台 ...

Group 1: Technology Innovations - Huawei launched the Mate 80 series smartphones featuring four new technologies: ultra-transparent Linglong screen, outdoor exploration mode, emergency communication without network, and second-generation red maple imaging. Prices start from 4699 yuan for Mate 80 and go up to 11999 yuan for Mate 80 RS [2] - Tencent introduced the open-source HunyuanOCR model with only 1 billion parameters, achieving state-of-the-art results in various OCR applications [4] - Baidu established two new research departments focused on developing general AI models and specialized application models, reporting directly to CEO Li Yanhong [5] Group 2: AI and Cloud Computing - Alibaba's CEO discussed the strong demand for AI, indicating a supply chain expansion cycle lasting at least two to three years, with AI resources remaining in short supply [3] - Amazon announced an investment of up to $50 billion to enhance its AI and high-performance computing services for U.S. government agencies, planning to build 1.3GW of new data center capacity [7] Group 3: Corporate Developments - "Zhihui Jun" was elected as the chairman of Upwind New Materials, with a new executive team appointed [6] - Ideal Auto's chairman revealed plans to launch AI glasses and an AI speaker, emphasizing the integration of AI capabilities into their product ecosystem [8] Group 4: Market and Investment Activities - Demingli plans to raise up to 3.2 billion yuan through a private placement to fund SSD and DRAM expansion projects [12] - Purun Co. is in the process of acquiring a 49% stake in Zhuhai Noah Changtian Storage Technology Co., with the transaction still in the planning stage [13] - Dingtong Technology intends to acquire 70% of Shenzhen Blue Ocean Vision Technology Co. for 126 million yuan, focusing on machine vision equipment [16] - Chunqiu Electronics is making a voluntary offer to acquire all shares of Asetek A/S for up to 573 million Danish kroner, targeting the liquid cooling technology sector [17]

来源：环球网 【环球网报道 记者 徐思琦】据台湾《中国时报》、《工商时报》11月26日报道，就前资深副总经理罗 唯仁7月底退休、10月底前往英特尔就任执行副总裁，台积电昨日（25日）证实，已向法院正式提起对 前资深副总经理罗唯仁的诉讼，主张其违反聘雇合约、竞业禁止同意书及"营业秘密法"相关规定。台积 电认为，罗唯仁极有可能使用或泄漏、告知、交付或转移公司营业秘密及机密资讯予英特尔，因此公司 采取包括违约赔偿在内的法律行动。 报道称，法庭方面表示，25日确实收到台积电相关诉讼文书。台经济主管部门也发表声明，称会配合检 调调查。对于罗唯仁的"工研院院士"资格，台经济主管部门称，目前没有撤回，已请"工研院"研议。 台积电表示，罗唯仁2004年7月起任职于公司并担任副总经理，2014年2月升为资深副总经理，在2024年 3月间，公司将罗唯仁调任于"企业策略发展部"任资深副总经理，该部门性质为供董事长暨总裁咨询的 幕僚单位，职责上无须再监督或管理研发部门事务，然而在转任"企业策略发展部"后，罗唯仁仍要求研 发部门召开会议提供资料，以了解正在研发及处于未来规划中的先进制程技术。 全危机，甚至整个台湾可能都被掏空的情况下， ...

公众号记得加星标⭐️，第一时间看推送不会错过。 在现今ASIC与二线AI运算芯片愈来愈强调性价比的大环境下，EMIB是有一些优势存在。 IC设计相 关人士表示，和英特尔针对EMIB进行合作测试的业者有在增加的趋势，当然短时间或许还不会有什 么很大的出货量，但放眼长期，如果合作的成效不错，2.5D的EMIB，甚或是3D封装的Foveros制 程，都有机会稳定接到一些订单。 近期因为台积电的CoWoS先进封装产能高度吃紧，除了几个AI芯片龙头有能力大量"包产能"外，其 他特用芯片（ASIC）和二线的AI芯片业者，难以争取到足够CoWoS产能支援。值得注意的是，市场 陆续传出，英特尔（Intel）的EMIB先进封装制程，成为芯片业者的考量之一，半导体业界更盛传， 网通芯片大厂Marvell甚至联发科，都积极想要尝试，甚至可能有"前段投片台积电、后段找上英特 尔"的新生意模式。 英特尔先进封装实力不俗EMIB有吸引力 据了解，由于英特尔EMIB技术本身价格较为实惠，散热表现也不错，面对一些技术规格需求相对没 那么高的产品，确实是能够支援，部分ASIC厂商如Marvell、联发科传出已经试着透过采用EMIB制 程，来提 ...

Core Viewpoint - TSMC has filed a lawsuit against former senior vice president Luo Wei-ren for allegedly violating a non-compete agreement and potentially leaking confidential information to Intel [1][3]. Group 1: Legal Action - TSMC announced on November 25 that it has initiated legal proceedings against Luo Wei-ren, who served as a senior vice president since 2014 and is accused of breaching his non-compete agreement by joining Intel [1]. - The company claims that Luo's actions could lead to the disclosure of trade secrets and confidential information to Intel, necessitating legal action for breach of contract [1]. Group 2: Background of Luo Wei-ren - Luo Wei-ren has been with TSMC since July 2004 and was promoted to senior vice president in February 2014, with plans to retire on July 27, 2025 [1]. - After being reassigned to the "Corporate Strategy Development Department," Luo continued to request information from the R&D department, raising concerns about his intentions [1]. Group 3: Industry Reactions and Speculations - The news of Luo's potential move to Intel has sparked widespread speculation in Taiwan, with some questioning the motivations behind his actions, given his established career and status [3]. - Industry analysts suggest that there may be underlying strategic considerations, possibly involving tacit approval from TSMC's decision-makers to allow Luo's transition to Intel [4]. Group 4: Broader Implications - The situation reflects ongoing tensions in the semiconductor industry, particularly with U.S. government efforts to bolster domestic chip production and the implications for companies like TSMC [3][4]. - The lawsuit may serve to address public concerns while the true motivations and potential strategic alignments behind Luo's move remain uncertain [5].

Multinational chip contract manufacturing and design company Taiwan Semiconductor Manufacturing Co Ltd (NYSE:TSM) — more commonly known as TSMC — suffered a noticeable decline on Tuesday. While the foundry giant is rapidly expanding its cutting-edge 2-nanometer facilities from seven to ten sites (obviously a direct impact from the dramatic demand surge of artificial intelligence), it has also attracted attention for a less-than-auspicious news item.Part of the volatility that affected TSM stock on Tuesday m ...

Multinational chip contract manufacturing and design company Taiwan Semiconductor Manufacturing Co Ltd (NYSE:TSM) — more commonly known as TSMC — suffered a noticeable decline on Tuesday. While the foundry giant is rapidly expanding its cutting-edge 2-nanometer facilities from seven to ten sites (obviously a direct impact from the dramatic demand surge of artificial intelligence), it has also attracted attention for a less-than-auspicious news item.Part of the volatility that affected TSM stock on Tuesday m ...

Core Insights - The article discusses the transformative impact of silicon photonics technology, particularly through CPO (Co-Packaged Optics), on the AI computing landscape, highlighting its potential to overcome existing bandwidth and power consumption challenges [2][4]. Group 1: Technology Trends and Market Drivers - The demand for AI computing power is driving the integration of photonics, with bandwidth requirements increasing from 400G to 1.6T [9]. - CPO technology offers over 50% reduction in power consumption compared to traditional methods, significantly enhancing energy efficiency in large-scale data centers [9][31]. - The maturity of silicon photonics technology is evidenced by TSMC's COUPE platform, which is preparing for mass production with key device performance breakthroughs [9]. Group 2: Industry Ecosystem Restructuring - The shift from traditional pluggable optical modules to CPO represents a fundamental restructuring of the supply chain, moving value from module assembly to chip-level integration and advanced packaging [94]. - Major players in the CPO ecosystem include TSMC, NVIDIA, and Broadcom, each contributing to the development and standardization of CPO technology [99][100]. - Traditional optical module suppliers must evolve into silicon photonics and packaging experts to avoid being marginalized by chip giants [96]. Group 3: Opportunities and Challenges for Manufacturers - Manufacturers face challenges such as complex packaging technology, yield and cost control, and optical coupling process difficulties [10]. - The market presents opportunities for growth in equipment and materials demand, as well as trends in system vendor transformations and emerging application scenarios [10]. - A 3-5 year market forecast indicates significant potential for silicon photonics technology, driven by ongoing technological advancements [10]. Group 4: Future Outlook - The future of silicon photonics is poised for rapid growth, with expectations of doubling bandwidth requirements every 2-3 years [21]. - Companies are actively pursuing innovations in optical interconnect technologies to support advanced computing needs, with a focus on energy efficiency and performance [101]. - The integration of silicon photonics into existing semiconductor processes is expected to enhance the capabilities of AI and high-performance computing systems [67].

TSMC on Tuesday filed a lawsuit against a former senior vice president it accused of leaking "confidential information" to Intel.Wei-Jen Lo joined Intel after 21 years at TSMC, having left in July, the Taiwanese chip maker said in a statement, announcing the lawsuit.The lawsuit is based on Lo's employment contract and non-compete agreement with TSMC, and regulations such as the Trade Secrets Act, the statement said. "There is a high probability that Lo uses, leaks, discloses, delivers, or transfers TSMC's t ...

目前，台积电并未在公告中披露具体索赔金额及详细证据，仅强调将依法追究相关责任，以防止公司重要技术与机密信息外泄。业内人士认为，案件后续进 展及法院裁判结果，不仅关系双方当事人权益，也将为全球半导体行业高管流动与商业秘密保护提供新的参照样本。相关各方仍需尊重司法程序与最终裁 决，投资者亦应理性看待事件影响，持续关注后续披露情况。 公开信息显示，罗唯仁曾长期担任台积电资深副总经理，在公司先进制程技术、产线运营及客户服务等领域具有丰富经验，对企业内部流程与技术细节高度 熟悉。在半导体行业高度竞争的背景下，此类核心管理人员的流动，往往会被市场放大关注其是否涉及商业秘密与知识产权风险，相关企业也通常会通过合 约条款及司法途径维护自身权益。 近年来，随着全球晶圆代工与高端制程竞争愈发激烈，围绕技术专利、营业秘密和高端人才流动的纠纷时有发生，各大芯片厂商在合规与风控方面不断加 码。分析人士指出，头部晶圆代工厂在研发投入巨大、技术壁垒极高的情况下，对核心员工离职后的去向与信息隔离高度敏感，通过法律诉讼释放"零容 忍"信号，也是维护产业竞争秩序的一种方式。 （文/罗叶馨梅）11月25日，台积电发布公告称，已向智慧财产及商业法院 ...