用户期待的并非仅是免费维修，而是一套透明、公平、尊重消费者的售后体系。 多品牌手机遭遇"绿线门"，售后政策引不满 近期一场由手机屏幕绿线问题引发的消费维权潮在社交平台上持续发酵，涉及包括OPPO 、一加、 vivo、三星、小米、华为等几乎全部主流国产与国际品牌。面对同一类硬件问题，第一财经记者调查发 现，各大厂商的售后态度难让消费者满意。有厂商迅速响应、承诺满足一定条件免费换屏，但消费者在 实际操作中却困难重重，甚至同一品牌的不同网点售后也存在差异，有的以"过保"为由拒之门外，还有 要求用户提供早已遗失的发票，也有品牌"按闹分配"，令消费者倍感无奈。此外不少绿线问题手机屏幕 来自三星，该公司尚未有回应。 点评：绿线是一种相对常见的OLED显示屏故障，原因多种多样，包括驱动芯片脱焊或故障、线路氧化 断裂导致失效等。"硬件堆料卷到天花板，服务却留在地板"。有用户吐槽。在这场由一道绿线引发的消 费信任危机中，用户期待的并非仅是免费维修，而是一套透明、公平、尊重消费者的售后体系。营销时 强调"高端品质"，售后时却模糊执行，最终消耗的是用户信任。 京东方与三星在美国OLED 专利纠纷和解 过去英特尔以设计大型、复杂的单 ...

Core Insights - The development of generative AI is significantly driven by advanced chipsets, particularly GPUs, with Nvidia leading the market while AMD and Intel are also making strides in AI infrastructure [1][2] AMD's Data Center Business - AMD's data center segment has gained traction with the launch of its Instinct MI300 accelerators in Q4 2023, generating revenue comparable to Intel's within six months [4][5] - In Q3 2025, AMD's data center revenue reached $4.3 billion, marking a 22% year-over-year increase, while Intel's data center sales were $4.1 billion, reflecting a 1% annual decline [7] Intel's Position and Strategy - Intel's data center business has shown inconsistent performance, and the company is attempting to reinvent itself amidst competition from AMD [6][10] - Intel is diversifying its operations beyond data centers, offering various hardware products and foundry services [8] - A recent $5 billion investment from Nvidia, along with support from the U.S. government and SoftBank, aims to enhance Intel's next-generation CPU architectures, potentially benefiting its data center segment [9] Comparative Analysis - AMD's full-stack approach has led to consistent double-digit growth in its data center segment, contrasting with Intel's inconsistent growth trajectory [10]

Core Insights - The article highlights Intel's commitment to innovation and adaptation in the semiconductor industry, emphasizing the launch of the Intel 18A process technology as a cornerstone for future products [4][5][19]. Organizational Changes - Intel is evolving towards a flatter organizational structure, promoting a culture focused on engineering and customer-centric product development [3]. Business Strategy - Intel is dedicated to expanding its foundry business, being the only company that designs and manufactures chips while leveraging its extensive IP to assist clients in chip production [4]. - The company aims to strengthen its core businesses in PCs, edge computing, and servers while exploring new opportunities in robotics, consumer applications, and AI solutions [4]. Technological Advancements - The Intel 18A process technology marks a significant advancement, with over 15% performance improvement at the same power consumption and a 25% reduction in power consumption for the same performance compared to previous generations [5]. - The Panther Lake platform, based on Intel 18A, integrates high efficiency and performance, achieving a 50% increase in multi-core performance and over 50% improvement in graphics performance [8][12]. AI Integration - Intel is transitioning AI PCs from "AI-enhanced" to "AI-native," integrating software, hardware, and applications to create intelligent systems capable of multi-modal perception [9]. - The architecture of AI PCs includes hardware, software, and algorithm layers, focusing on optimizing performance and resource management [10]. Market Positioning - Intel is committed to a "fusion" strategy in the Chinese market, integrating products across different sectors to meet diverse customer needs [15]. - The company has established a robust business network in China, celebrating 40 years of market presence and collaboration with over 15,000 partners [16][18]. Future Directions - Intel plans to adopt a chiplet design approach, allowing for more flexible and customizable chip solutions to meet specific market demands [20]. - The company aims to enhance local computing capabilities through innovations like the aiDAPTIV+ technology, which accelerates model inference speeds [14].

Core Insights - The report highlights the rapid growth and potential of the Chinese smart chip industry, driven by advancements in artificial intelligence, IoT, and 5G technology, with a projected market size exceeding 600 billion yuan by 2030 [1][2][3] Industry Overview and Background Analysis - Smart chips are defined as highly integrated circuits capable of perception, computation, and decision-making, integrating AI algorithms and big data analysis to respond to complex environments [8][9] - The smart chip industry in China has evolved from reliance on imports to developing domestic capabilities, with significant government support and technological breakthroughs in recent years [19][23][24] Market Size and Growth Trends - The Chinese smart chip market has experienced a compound annual growth rate (CAGR) of over 20% from 2018 to 2022, driven by demand in consumer electronics, smartphones, and IoT applications [33][35] - The AI chip segment is the largest, accounting for over 40% of the market, with rapid growth in autonomous driving and edge computing chips [36][41] Technological Development and Innovation Trends - Key technologies in smart chips include Neural Processing Units (NPUs) optimized for AI tasks, edge computing for real-time data processing, and innovations in high-performance computing architectures [51][54][57] - The report emphasizes the importance of hardware-software co-design and the integration of advanced semiconductor processes to enhance performance and reduce power consumption [52][58]

Seven tech giants have weighed in on India’s 6 GHz spectrum debate, asking authorities to drop the auctioning of the spectrum and opt for a more social-welfare valuation approach.Rather than setting timelines for future auction, Amazon, Apple, Broadcom, Cisco Systems, Meta Platforms, Hewlett Packard Enterprise and Intel Corporation in a joint submission asked the Telecom Authority of India (TRAI) to align the allocation of the upper 6 GHz band with the World Radio Conference 2027 regulations. In the interim ...

Core Viewpoint - Recent rumors regarding TSMC's former executive, Luo Wei-ren, taking confidential information to Intel have sparked significant attention in Taiwan, with Intel's CEO denying these claims as baseless [1][3]. Group 1: Company Actions and Reactions - TSMC has initiated an internal investigation to determine if Luo Wei-ren took confidential business information without permission, although the extent of potential damage remains unclear [3]. - TSMC has not publicly commented on the situation, which raises questions about their internal protocols and response strategies [3]. - The Taiwanese government has downplayed the incident's impact on the semiconductor industry, suggesting that TSMC's long-standing reputation and infrastructure cannot be easily undermined by one individual's actions [3]. Group 2: Industry Implications - The incident has led to speculation about whether Luo's move to Intel was sanctioned by TSMC's management, potentially to assist Intel in advancing its technology [4]. - Concerns have been raised about the implications of this event on TSMC's competitive edge, especially given its leadership in wafer foundry services compared to Intel [1][4]. - The situation has prompted discussions about the effectiveness of TSMC's confidentiality agreements and internal controls, particularly in light of previous leaks within the company [3].

Core Insights - Intel's CEO Chen Lifang delivered a speech in Chinese at the 2025 Intel Technology Innovation and Industry Ecosystem Conference, emphasizing the company's commitment to collaboration in the AI wave and celebrating 40 years in the Chinese market [1][2] - The conference gathered over 3,000 attendees, including clients and industry partners, to discuss building an intelligent, integrated, and green industry ecosystem [1] - Intel announced the mass production of its Intel 18A process at the Arizona Fab 52 plant, achieving a 30% increase in transistor density and a 15% performance improvement at the same power consumption compared to the previous generation [2][3] Company Developments - The third-generation Core Ultra processor, based on the new 18A process, features significant performance enhancements, including over 50% improvement in CPU performance and graphics performance [3] - Intel's Xeon 6+ processors, also based on the 18A process, are set to be released in the first half of 2026, marking a new era of efficiency in server processors [3] - The Intel 18A process is expected to be the foundation for Intel's next three generations of PC and data center products, with ongoing development of even more advanced processes like Intel 14A [3] Industry Trends - The conference showcased over 1,000 industry ecosystem collaboration results, highlighting innovations in AI PCs, generative AI applications, and data center solutions [4] - Intel's collaboration with local partners led to the launch of a dual-processor liquid-cooled server, enhancing reliability and efficiency while reducing energy consumption and operational costs [4] - The Chinese market is positioned as a global leader in digitalization, with Intel focusing on four development directions: digitalization, intelligence, integration, and globalization [5]

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 引言 当芯片制程的微缩逼近物理与经济的双重极限，集成电路产业的发展动能，正前所未有地从晶体管尺度 的缩小，转向系统级集成与架构的创新。在这一被称为"后摩尔时代"的产业变局中， 先进封装与测试 （简称"先进封测"） 已从配套辅助环节，跃升为提升芯片性能、优化系统功耗、控制整体成本的关键 支点。 本文旨在深入剖析全球及中国先进封测行业的 发展现状、技术脉络、市场格局与驱动因素 ，并前瞻性 地展望在人工智能、高性能计算等需求的强劲牵引下，该领域所孕育的 未来机遇与发展趋势 。 一、集成电路先进封测概况 1、集成电路制造概况 集成电路制造产业链主要包括芯片设计、晶圆制造、封装测试三个环节，具体如下： 封装测试包含封装和测试两个环节 ，其中，封装是指将集成电路与引脚相连接以达到连接电信号的目 的，并使用塑料、金属、陶瓷、玻璃等材料制作外壳保护集成电路免受外部环境的损伤； 测试包括进入封装前的晶圆测试（CP）和封装完成后的成品测试（FT），晶圆测试主要检验每个晶粒 的电性能，成品测试主要检验产品的电性能和功能，目的是将有 ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 过去一周，中国台湾地区媒体一直在报道台积电前高管罗唯仁回归英特尔的消息。罗唯仁今年75岁，在今年7月从台积电退休。 台媒称， 罗唯仁在最近几周加入了英特尔，并且就在离职前带走了台积电的专有技术，甚至包括2纳米先进制程机密。 "这些都是传言和猜测，没这回事。我们尊重知识产权。"陈立武周四在圣何塞出席半导体产业协会(SIA)颁奖典礼期间对彭博社表示。在此 次活动上，SIA向台积电CEO魏哲家和前董事长刘德音颁发了最高荣誉：罗伯特·诺伊斯奖。 台积电目前市值超过1.15万亿美元，已成为全球芯片代工领域无可争议的领导者，超越了半导体先锋英特尔。 该公司的专有数据和制造技 术是极具价值的商业机密，也是中国台湾地区具有战略重要性的资产。 中国台湾高等检察署发言人聂众向记者表示，当地检方已开始就相 关报道展开调查，以核实是否存在人员涉嫌违法。 知情人士透露，台积电已就罗唯仁是否未经同意带走商业机密一事启动内部调查。目前尚不清楚台积电是否已就此事对公司可能造成的损 害程度得出结论。 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 11月21日消息， 针对 台积电 ...

11月21日，美股多只芯片、科技概念股盘前走低，英伟达跌幅一度扩大至3%。截至北京时间20:24，英伟达、台积电跌超2%、英特尔、AMD跌超1%。其 他热门科技股也普跌，特斯拉跌近0.5%，脸书跌近1%。 | 名称 品 E | 现价 | 涨跌幅 →▶ | | --- | --- | --- | | 超威半导体(AMD) | 206.020 | -7.84% | | US AMD | 202.160 | -1.87% 盘前 | | 英特尔(INTEL) | 33.620 | -4.24% | | US INTC | 33.120 | -1.49% 盘削 | | 英伟达(NVIDIA) | 180.640 | -3.15% | | US NVDA | 176.290 | -2.41% 盘前 | | 亚马逊(AMAZON) | 217.140 | -2.49% | | US AMZN | 216.500 | -0.29% 盘前 | | 特斯拉(TESLA) | 395.230 | -2.17% | | US TSLA | 393.350 | -0.48% 盘前 | | 台积电 | 277.500 | -1.72% ...