央行：科技创新债券准备工作基本就绪，近100家机构计划发行超过3000亿元

Group 1 - The People's Bank of China (PBOC) is set to enhance financial support for technological innovation through the introduction of a "Technology Board" in the bond market, aimed at facilitating the issuance of technology innovation bonds by financial institutions, technology enterprises, and equity investment institutions [1][3] - Nearly 100 market institutions are planning to issue over 300 billion yuan in technology innovation bonds, indicating strong market interest and participation [3] - The PBOC has established a risk-sharing tool for technology innovation bonds, which will provide low-cost refinancing funds to support long-term bond issuance by equity investment institutions, potentially extending to 8-10 year bonds [4] Group 2 - Equity investment institutions play a crucial role in supporting technological innovation, having contributed to nearly 90% of companies listed on the Sci-Tech Innovation Board and 60% on the Growth Enterprise Market [4] - The PBOC has implemented two capital market support tools, with the swap facility having conducted operations totaling 105 billion yuan, and over 500 listed companies announcing stock repurchase financing amounting to approximately 300 billion yuan [4][5] - The usage of the swap facility has increased during periods of market stress, demonstrating its effectiveness in stabilizing market expectations and correcting market overreactions [5]