杭州银行拟发行50亿元2025年科创债券

Core Viewpoint - Hangzhou Bank will issue RMB 5 billion in technology innovation bonds with a maturity of 3 years, indicating a strategic move to enhance its capital structure and support technological advancements in the region [1] Group 1: Bond Details - The bond will be issued at a face value of RMB 100 and will be sold at par [1] - The interest rate will be fixed and determined through a book-building process, remaining unchanged throughout the bond's duration [1] - The bonds will have an annual interest payment schedule, with the first interest payment on May 12, 2025, and the principal repayment on May 12, 2028 [1] Group 2: Issuance and Payment Structure - The bonds will adopt a real-name bookkeeping system and will not accrue interest in case of overdue payments [1] - Payment dates for interest will be adjusted in case of public holidays, ensuring timely payments [1]