Ninestar(SZ:002180) Zheng Quan Shi Bao Wang·2025-05-14 10:58Group 1: Forum Overview - The 2025 Summit will focus on "Embodied Intelligent Robots," featuring ten semiconductor companies presenting solutions in areas such as computation, perception, motion control, and communication [1] - Key challenges in the industrialization of embodied intelligent robots include precise motion control and generalized action capabilities [1][6] Group 2: Chip Developments - Chipsea Technology introduced the D9-Max, a high-performance edge AI SoC designed for embodied intelligence applications, emphasizing functional safety and meeting automotive standards [2] - Aixin Yuan Zhi's AX8850 processor integrates an eight-core A55 CPU and a high-performance NPU, supporting mainstream large model structures and real-time spatial interaction [2] - Wan You Jing Li launched the EB100 chip for low-power spatial rendering and display, already adopted by leading clients like Goer and Zhi Yuan Robotics [3] - Shanghai Xianji Semiconductor's HPM6E8Y chip features a RISC-V dual-core architecture for high-precision motion control in robotics [4] - Nasta's G32R501 chip is the world's first high-end real-time control MCU based on a dual-core Arm Cortex-M52 architecture, designed for harsh environments [5] Group 3: Industry Trends and Challenges - The integration of multi-sensor fusion is seen as crucial for enhancing perception and cognition in robots, with expectations that future robots will surpass human capabilities in perception [6] - The transition from copper to optical networks in robot communication is anticipated to address data transmission challenges and improve efficiency [7] - The most promising applications for humanoid robots in the next three years are expected to be in warehousing, logistics, hazardous environments, and security inspections [7]