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Counterpoint:需求强劲 台积电(TSM.US)3nm制程成为其史上最快达成全面利用的技术节点
TSMCTSMC(US:TSM) 智通财经网·2025-05-15 12:39

Group 1 - TSMC has solidified its leading position in the global foundry market after inventory adjustments at the end of 2022, with high utilization rates in advanced process technologies [1] - The 3nm process has achieved full capacity utilization in its fifth quarter of mass production, driven by strong demand for Apple A17 Pro/A18 Pro chips and other application processors, setting a new record for initial market demand [1] - Future growth is expected to continue due to the introduction of NVIDIA Rubin GPUs and specialized AI chips from Google and AWS, driven by increasing demand in AI and high-performance computing (HPC) applications [1] Group 2 - In contrast, the smartphone market has seen slower initial capacity growth for existing processes like 7/6nm and 5/4nm, with the latter experiencing a resurgence in 2023 due to surging demand for AI acceleration chips [2] - The demand for AI computing chips is accelerating the construction of AI data centers and significantly enhancing the overall capacity of the 5/4nm process [2] Group 3 - The 2nm process is projected to achieve full capacity utilization in its fourth quarter of mass production, driven by dual demand from smartphones and AI applications, aligning with TSMC's strategic outlook [5] - Potential customers for the 2nm technology include Qualcomm, MediaTek, Intel, and AMD, which is expected to maintain high utilization rates for the 2nm process [5] Group 4 - TSMC is investing $165 billion in its Arizona facility to meet growing U.S. consumer demand and mitigate geopolitical risks, with the facility covering 4nm, 3nm, and 2nm processes [11] - The dual-layout strategy enhances TSMC's geopolitical resilience and ensures capacity meets customer demand, particularly in AI and HPC, while maintaining high utilization rates for advanced processes beyond 2030 [11]