Broadcom Announces Third-Generation Co-Packaged Optics (CPO) Technology with 200G/lane Capability

Core Insights - Broadcom has launched its third-generation 200G per lane co-packaged optics (CPO) product line, demonstrating advancements in technology and ecosystem readiness for AI applications [1][4] - The company has established a comprehensive ecosystem of partners to support the deployment of its CPO technology, which is crucial for scaling AI infrastructure [5][7] Company Developments - Broadcom's leadership in CPO technology began with the introduction of the first-generation Tomahawk 4-Humboldt chipset in 2021, which set the foundation for subsequent innovations [2] - The second-generation Tomahawk 5-Bailly chipset became the first volume-production CPO solution, focusing on automated testing and scalable manufacturing processes [3] - The third-generation 200G/lane CPO technology is designed for high-radix scale-up and scale-out networks, addressing the demands of next-generation AI workloads [9][10] Ecosystem and Partnerships - Broadcom has announced significant partnerships with key industry players, including Corning, Delta Electronics, Foxconn Interconnect Technology, and Micas Networks, to enhance its CPO technology and support mass deployment [7][8] - These collaborations have led to advancements in fiber and connector technology, production of CPO Ethernet switches, and high-density CPO fiber cables, further solidifying the CPO ecosystem [7][8] Future Outlook - Broadcom is committed to developing a fourth-generation 400G/lane solution, continuing its leadership in delivering high bandwidth density and low power optical interconnects [4][6] - The company emphasizes the importance of open standards and system-level optimization to ensure the success and evolution of its CPO technology in hyperscale data centers [10]