PAB(000001) 北京商报· Bei Jing Shang Bao·2025-05-16 08:32Group 1 - The People's Bank of China and the China Securities Regulatory Commission jointly announced measures to support the issuance of technology innovation bonds, with Ping An Bank's Beijing branch leading the underwriting of BOE Technology Group's 1 billion yuan (approximately 0.15 billion USD) bond project [1] - The bond has a 10-year term and a coupon rate of 2.23%, with a strong market response resulting in 3.15 times oversubscription [1] - The funds raised will be specifically used for technological upgrades in the semiconductor display sector, reinforcing BOE's position as a global leader [1] Group 2 - BOE Technology Group, established in April 1993, is a leading IoT innovation enterprise with a business structure centered on semiconductor displays and a strong global market presence [2] - The company is expected to see a 108.97% year-on-year increase in net profit attributable to shareholders in 2024, indicating strong cash flow and risk resilience [2] - The raised funds will focus on "hard technology" to support high-generation production line construction and core technology breakthroughs, accelerating the domestic substitution process [2]