UPDATE -- ClassOne Technology and IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing

Core Insights - ClassOne Technology has signed a joint development agreement with IBM Research to focus on wet processing for advanced packaging in semiconductor manufacturing [1][2] - The collaboration aims to develop best known methods (BKMs) for non-NMP solvent processing, which is crucial for manufacturing IBM semiconductor devices [2] - ClassOne has been a strategic supplier to IBM since 2014, expanding its technology offerings from electroplating and metal lift-off to advanced packaging applications [3][4] Company Overview - ClassOne Technology is a leading provider of advanced electroplating and wet processing systems for semiconductor and microelectronic device manufacturing globally [4] - The company's flagship Solstice platform offers highly configurable, fully automated wet processing applications with competitive ROI, serving critical wafer processes for various markets including photonics, power, 5G, microLED, and MEMS [4]