Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

Group 1 - Deca Technologies has signed an agreement with IBM to implement its M-Series™ and Adaptive Patterning® technologies in IBM's advanced packaging facility in Bromont, Quebec [1][2] - The collaboration aims to enhance IBM's advanced packaging capabilities, positioning the Bromont plant as a critical hub for high-performance packaging and chiplet integration [2][4] - Deca's M-Series platform is recognized as the highest-volume fan-out packaging technology globally, with over seven billion units shipped, and the MFIT™ technology offers cost-effective alternatives for chiplet integration [3][6] Group 2 - The partnership reflects a shared commitment to advancing semiconductor packaging, combining IBM's capabilities with Deca's technology to expand the global supply chain for high-performance chiplet integration [4][5] - Advanced packaging and chiplet technology are essential for improving computing solutions in AI and data-heavy applications, with Deca's involvement ensuring IBM's Bromont facility remains innovative [5] - Deca Technologies is a leading provider of advanced packaging technology, with its M-Series™ fan-out technology emerging as a key industry standard for future semiconductor applications [6]