桐昆股份: 桐昆集团股份有限公司关于2025年度第三期科技创新债券发行结果的公告

Core Points - The company has approved the issuance of short-term financing bonds up to 6 billion RMB, subject to shareholder approval at the annual meeting on May 21, 2024 [1] - The registration for the short-term financing bonds has been accepted by the trading association, with a registered amount of 6 billion RMB [1] - The company plans to issue a total of 500 million RMB in technology innovation bonds, with a fixed interest rate of 1.84% [1] Summary by Category Financing Activities - The company’s board has approved a proposal to issue short-term financing bonds not exceeding 6 billion RMB, pending approval from the shareholders [1] - The trading association has accepted the registration for the short-term financing bonds, confirming a registered amount of 6 billion RMB [1] Bond Issuance Details - The company plans to issue technology innovation bonds with a total issuance amount of 500 million RMB [1] - The interest rate for the technology innovation bonds is set at 1.84%, with the issuance price at 100 RMB per 100 RMB face value [1] - The effective subscription amount for the technology innovation bonds reached 530 million RMB, with 12 compliant subscription entities participating [1]