SMIC(688981) 搜狐财经·2025-05-22 02:15Group 1 - The core viewpoint of the news is that Semiconductor Manufacturing International Corporation (SMIC) has applied for a patent related to a "wafer and packaging method," indicating ongoing innovation in semiconductor manufacturing technology [1] - The patent application was filed on November 2023, and the publication number is CN120015637A, highlighting the company's commitment to advancing its technological capabilities [1] - The patent describes a method that includes a substrate, dielectric layer, and two bonding layers, which aims to improve the bonding strength of the edge chip area in bonded wafers, thereby addressing precision errors in the manufacturing process [1] Group 2 - SMIC Beijing was established in 2002 with a registered capital of 100 million USD, focusing on the manufacturing of computers, communications, and other electronic devices [2] - SMIC Shanghai was founded in 2000 with a registered capital of 244 million USD, also specializing in the same sectors as its Beijing counterpart [2] - Both companies have significant patent portfolios, with each holding around 5,000 patent records, indicating a strong emphasis on research and development [2]