朱鹤新：通过债券市场“科技板”解决股权投资机构发债期限短、融资成本高的问题

Group 1 - The Ministry of Science and Technology, along with several financial regulatory bodies, has issued a set of policy measures aimed at enhancing the support for high-level technological self-reliance and innovation in China [1] - A new "Technology Board" in the bond market has been established to better support technology innovation, allowing financial and equity investment institutions to issue technology innovation bonds [1] - Key features of the differentiated bond issuance and trading system include flexible installment issuance, simplified information disclosure requirements, and reduced transaction fees [1] Group 2 - Equity investment institutions are identified as the most critical entities needing support in issuing technology innovation bonds, as they play a vital role in fostering innovation capital formation [2] - The Technology Board will create risk-sharing tools for technology innovation bonds, with the People's Bank of China providing low-cost refinancing funds to mitigate risks for bond investors [2] - Nearly 100 institutions have already responded positively, issuing technology innovation bonds totaling over 250 billion [2]