SCC(SZ:002916) Zheng Quan Zhi Xing·2025-05-22 10:21Fundraising Overview - The company has raised a total of RMB 2,529,664,782.94 through a non-public offering of 23,694,480 shares, approved by the China Securities Regulatory Commission [1] - The funds will be primarily used for the manufacturing project of high-end flip chip IC substrates, with a total investment of RMB 276,627,000 and planned fundraising of RMB 255,000,000 [1] Change of Project Implementation Entity - The company has approved a change in the project implementation entity for the high-end flip chip IC substrate manufacturing project from its wholly-owned subsidiary Wuxi Shennan to another wholly-owned subsidiary, Wuxi Guangxin Packaging Substrate Co., Ltd. [2] Fund Management and Storage - The company has revised its fundraising management system to ensure dedicated storage and usage of the raised funds, in compliance with relevant laws and regulations [2] - The management system includes provisions for fund storage, usage, project management, and supervision of investment projects [2] Fund Supervision Agreements - The company has signed tripartite and quadripartite supervision agreements with banks and underwriters to ensure proper management of the raised funds [3] - A new quadripartite supervision agreement was signed following the change of the project implementation entity [3] Fund Account Status - The company has closed several fundraising accounts, including those at China Bank and Agricultural Bank, as part of its fund management strategy [5] - The company has transferred RMB 54,764,800 from one of its fundraising accounts to its own funds and completed the account closure [6]