深南电路在接受机构调研时表示，公司封装基板业务产品覆盖种类广泛多样，包括模组类封装基板、存 储类封装基板、应用处理器芯片封装基板等，主要应用于移动智能终端、服务器/存储等领域。2025年 第三季度，封装基板营业收入环比增加，各下游领域产品需求均有增长，其中存储类封装基板增长最为 显著。 (本文来自第一财经) ...

人民财讯12月2日电，深南电路（002916）12月2日在机构调研中表示，公司封装基板业务产品覆盖种类 广泛多样，包括模组类封装基板、存储类封装基板、应用处理器芯片封装基板等，主要应用于移动智能 终端、服务器/存储等领域。2025年第三季度，封装基板营业收入环比增加，各下游领域产品需求均有 增长，其中存储类封装基板增长最为显著。 ...

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 Q3、请介绍 2025 年第三季度 PCB 业务各下游领域经营拓展情况。 公司 PCB 业务产品下游应用以通信设备为核心，重点布局数据中心（含服务器）、汽车 电子等领域，并长期深耕工控、医疗等领域。2025 年第三季度，数据中心、有线通信业务收 入持续增长，各业务领域占比与上半年基本一致。 Q4、请介绍 2025 年第三季度封装基板业务经营拓展情况。 公司封装基板业务产品覆盖种类广泛多样，包括模组类封装基板、存储类封装基板、应 用处理器芯片封装基板等，主要应用于移动智能终端、服务器/存储等领域。2025 年第三季 度，封装基板营业收入环比增加，各下游领域产品需求均有增长，其中存储类封装基板增长 最为显著。 编号：2025-40 | 投资者关系 | √特定对象调研 □分析师会议 □现场参观 | | --- | --- | | 活动类别 | □媒体采访 □业绩说明会 □新闻发布会 | | | □路演活动 □其他 （ ） | | 活动参与人 员（排名不 | 财通基金、国信证券、Capstone Capital、UBS、TRIVES ...

29 November 2025 | 12:30AM HKT Equity Research GC Tech: Shengyi (600183.SS): CCL factory visit; AI / data center drives demand ahead We recently visited Shengyi Technology's (600183.SS, Not Covered) copper clad laminate (CCL) factory in Dongguan and talked to management. Shengyi offers CCL and is expanding from consumer electronics / automotive to the data center market. Key discussions focused on (1) 2026 volume / pricing outlook; (2) CCL capacity expansion; (3) raw material supply; and (4) data center bus ...

Investment Rating - The report maintains an "Outperform" rating for the PCB industry [2]. Core Insights - The industry is entering a new AI-driven cycle, fundamentally changing demand structures. The construction of AI server clusters is leading to simultaneous upgrades in PCB demand and pricing. The expected market for wired communication PCBs will reach 206.9 billion RMB by 2027, with a CAGR of 20% over the next two years [4]. - High-end PCBs are expected to remain in tight supply until 2027, with major global manufacturers expanding production aggressively. The combined output of 13 leading PCB manufacturers is projected to reach 186 billion RMB by 2027, with a CAGR of 54% from 2025 to 2027 [4]. - The trend towards high-end PCB manufacturing is accelerating due to technological iterations and material upgrades. The industry is expected to see a three-pronged evolution in materials, processes, and architectures driven by AI [4]. - The demand surge and profit improvement in upstream materials present opportunities for domestic substitution. The price of copper-clad laminates has risen significantly, and domestic manufacturers are making notable progress in high-end materials [4]. - The PCB industry is experiencing a long-term trend of simultaneous growth in volume, price, and structure, driven by AI. The report recommends focusing on leading companies with high-end manufacturing capabilities and overseas delivery layouts [4]. Summary by Sections AI-Driven Growth - The AI cycle is expected to drive significant growth in PCB demand, particularly in AI servers, high-speed switches, and optical modules. The total market for wired communication PCBs is projected to reach 1,433 billion RMB by 2025 and 1,815 billion RMB by 2026 [19]. Production Capacity Expansion - Major PCB manufacturers are announcing aggressive expansion plans, with significant investments in new production facilities in Southeast Asia and domestic high-end capacity [15]. Technological Advancements - The report highlights the rapid adoption of mSAP technology in AI servers and switches, which is essential for meeting the demands of high-density signal transmission [4][21]. Market Dynamics - The report notes that the global PCB market is expected to face a supply-demand gap of nearly 20 billion RMB by 2026, although this gap is anticipated to narrow by 2027 [19]. Key Players - The report identifies leading companies such as Huada Technology, Jingwang Electronics, and Shenghong Technology as key players to watch in the PCB industry due to their high-end manufacturing capabilities and strategic expansion plans [4].

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 | 编号：2025-39 | | --- | | 投资者关系 | √特定对象调研 □分析师会议 □现场参观 | | --- | --- | | 活动类别 | □媒体采访 □业绩说明会 □新闻发布会 | | | □路演活动 □其他 （ ） | | 活动参与人 | 东吴证券、Intac Investment Fund、复星资管、CyberAtlas Fund、New Wealth Changan | | 员（排名不 分先后） | China、Bank of China Asset Management、Harmolands Capital、Dragonstone、高盛（亚洲） | | 上市公司 | 战略发展部总监、证券事务代表：谢丹；证券事务主管：阳佩琴 | | 接待人员 | | | 时间 | 年 月 日-28 日 2025 11 25 | | 地点 | 公司会议室、网络及电话会议 | | 形式 | 实地调研、网络及电话会议 | | 投资者关系 | 交流主要内容： | | 活动主要内 | 年三季度经营业绩情况。 Q1、请介绍公司 ...

Core Viewpoint - The Chinese equity market is expected to perform well due to multiple supporting factors, with a tactical overweight view on A/H shares maintained by Guotai Junan Securities [1] Group 1: Market Performance - On November 25, 2025, the three major A-share indices opened higher, with the CSI A500 index rising by 1.10% [1] - Key stocks such as Huadian Co., Ltd. and Shenzhen South Circuit rose significantly, with Huadian hitting the daily limit and others like Shenghong Technology and Fuhua also seeing substantial gains [1] Group 2: Investment Outlook - Guotai Junan Securities highlights that the recent volatility and panic selling have released micro trading risks, creating a favorable environment for the market to establish new expectations as the 14th Five-Year Plan begins [1] - The firm believes that the regulatory authorities are determined to stabilize the capital market, and factors that previously caused valuation discounts have dissipated, indicating a potential upward trend in valuations [1] Group 3: Index Composition - As of October 31, 2025, the top ten weighted stocks in the CSI A500 index include major companies like CATL, Kweichow Moutai, and China Ping An, accounting for a total of 19.36% of the index [1] Group 4: Investment Products - Investors without stock accounts can access the A500 ETF through the A500 ETF Jiashi linked fund, allowing for a one-click investment in the top 500 A-share companies [2]

PCB概念震荡反弹，沪电股份涨停，生益电子、深南电路、胜宏科技等涨幅靠前。 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 11月25日，A股三大指数集体高开。截至发稿，沪指涨0.61%，深证成指涨超1%，创业板指涨超2%。 | 上证指数 | 深证成指 | 创业板指 | | --- | --- | --- | | 3860.12 | 12774.40 | 2993.12 | | 23.35 0.61% | 189.32 1.50% | 64.08 2.19% | CPO概念拉升，德科立、瑞斯康达、可川科技、长飞光纤等涨停，长芯博创、光库科技等涨超10%。 | < V | CPO概念 | | | 2 O | | --- | --- | --- | --- | --- | | | 4323.41 | 5.29% | | | | 分时 五日 | 日K | 周K | 目K | 更多,◎ | | 成份股 | 股吧 | | | 资讯 | | 名称 | 最新 | 涨幅 ↓ | | 涨跌 | | 德科立 | 142.56 | 20.00% | | 23.76 | | 688205 科创 融 | | ...

Core Insights - The electronic sector has significantly outperformed the market since 2025, driven by substantial capital expenditures and demand for computing power from major companies like Google, Meta, Microsoft, and Amazon, which collectively spent nearly $100 billion in Q3 2025, a year-on-year increase of approximately 70% [1] - The demand for high-end PCBs (Printed Circuit Boards) has surged due to the explosion of computing power, particularly for AI servers, which require advanced PCB designs [1] - The global PCB market is projected to approach $95 billion by 2029, with the specialized PCB market for AI and high-performance computing expected to grow at a compound annual growth rate (CAGR) exceeding 20% from 2024 to 2029 [1] Semiconductor Sector - In Q3 2025, top performers in the semiconductor sector included companies like Silan Micro with a 1109% year-on-year growth and Geke Micro with 519% [2] - The strong performance of Nvidia and Google's AI advancements indicate that the AI industry is in an accelerating growth phase, presenting opportunities in the PCB sector as it aligns with AI chip upgrades [2] PCB Sector - Companies in the PCB sector, such as Shenghong Technology and Shennan Circuit, reported significant revenue and net profit growth, reflecting the rapid increase in orders for AI servers and related equipment [1][2] - The PCB market is experiencing a transformation driven by AI, which is reshaping the value chain of the electronic industry and creating new growth opportunities [2] Market Activity - On November 24, 2025, the PCB sector saw active trading, with stocks like Pengding Holdings and Huadian Shares rising over 1%, indicating positive market sentiment [3] - The electronic ETF (515260), which focuses on core leaders in the electronic sector, has attracted significant investment, with a total of 11.2 million yuan in inflows over three days, reflecting investor confidence in the sector's future performance [3] Investment Tools - The electronic ETF (515260) and its linked funds are designed to track the electronic 50 index, focusing on semiconductor and consumer electronics sectors, including high-demand areas like AI chips and 5G [5][6] - The ETF's composition heavily features the Apple supply chain, which accounts for 44.63% of its holdings, benefiting from the anticipated strong performance of Apple's product line [6] - Government policies are supporting the semiconductor industry, aiming for self-sufficiency and leveraging AI to enhance consumer electronics, positioning the electronic sector for potential growth [6]

Summary of Shennan Circuits (002916.SZ) Conference Call Company Overview - **Company**: Shennan Circuits (002916.SZ) - **Market Cap**: Rmb102.6 billion / $14.4 billion - **Target Price**: Rmb254.00, raised by approximately 70% from previous estimates - **Current Price**: Rmb199.96 - **Upside Potential**: 27.0% [1][30] Key Industry Insights - **Industry Focus**: Transition from telecom PCB to AI PCB, targeting compute and networking demands, particularly in the context of the growing market for 800G and 1.6T optical transceivers [1][22] - **Growth Drivers**: - Expansion of high-end PCB capacity in Jiangsu and Thailand factories [1][23] - Increased demand for AI PCB from AI accelerators, optical transceivers, and switches [1][22] - Strong growth in IC substrate business driven by memory chips [1][24] Financial Performance and Projections - **Earnings Growth**: Expected net income growth of 44% CAGR from 2025 to 2027 [1] - **Revenue Estimates**: - 2025: Rmb22,775 million (up 7% from previous estimates) - 2026: Rmb28,491 million (up 15%) - 2027: Rmb35,503 million (up 29%) [1][27] - **Gross Margin Improvement**: Anticipated increase in gross margin by 2.6ppts, 2.7ppts, and 3.4ppts for 2025, 2026, and 2027 respectively [1][26] Competitive Positioning - **Market Position**: Shennan has established long-term partnerships in the telecom sector, which aids its entry into the data center PCB market [4] - **Competitive Risks**: Potential competition from peers with higher exposure to AI and data centers, which could impact pricing and margins [4][37] Capacity and Production - **Capacity Expansion**: Significant ramp-up in production capacity expected from the Jiangsu Nantong factory and Thailand factory in 2026 [19][23] - **Product Mix Upgrade**: Transition towards high-layer count PCBs and optical transceivers, with a projected increase in AI PCB revenue contribution to 28%, 36%, and 41% of total PCB revenues from 2025 to 2027 [22] Investment Thesis - **Recommendation**: Maintain Buy rating based on strong growth prospects in AI PCB and IC substrate markets, supported by capacity expansion and product upgrades [1][30] - **Risks**: Slower-than-expected expansion into AI PCB, increased competition, customer concentration risks, and slower growth in server/automotive PCB and IC substrate markets [37] Conclusion - Shennan Circuits is positioned to benefit from the growing demand for AI PCBs and high-end IC substrates, with significant revenue and earnings growth projected over the next few years. The company's strategic expansion and product upgrades are expected to enhance its competitive edge in the evolving technology landscape.