“一码”直通助企业直接融资 成都举行科技创新债券赋能实体经济活动

Group 1 - The introduction of the "Technology Board" for bonds aims to provide new financing channels for private enterprises, addressing their fundraising difficulties [2][4] - Nearly 100 institutions have issued technology innovation bonds, amounting to over 250 billion yuan, presenting unprecedented opportunities for technology innovation enterprises in Chengdu [4][5] - Chengdu has seen a total bond financing scale of 106.55 billion yuan since 2025, with 135.06 million yuan specifically from technology innovation bonds [4][5] Group 2 - The technology innovation bonds are designed to provide long-term, stable, and low-cost funding support for the real economy, which is crucial for high-quality development and enhancing industrial parks [5][6] - Recent activities have attracted over 180 issuing entities and more than 50 financial service institutions, indicating strong interest and engagement in the bond market [6][8] - The event included face-to-face consultations where experts provided tailored advice on bond issuance processes, helping enterprises navigate the financing landscape [8]