深南电路：公司FC-BGA封装基板目前已具备20层及以下产品的批量生产能力，最小线宽线距达9/12μm。

Core Viewpoint - The company has achieved mass production capability for FC-BGA packaging substrates with 20 layers and below, featuring a minimum line width and spacing of 9/12μm [1] Group 1 - The company specializes in FC-BGA packaging substrates [1] - The current production capability includes products with 20 layers or fewer [1] - The minimum line width and spacing achieved is 9/12μm [1]