中芯国际申请半导体结构及其形成方法专利，在增加ESD结构的鲁棒性的同时，具有双向ESD保护特性

Core Viewpoint - Semiconductor companies, specifically SMIC, are actively pursuing innovation through patent applications, indicating a focus on enhancing semiconductor structures and methods, which may strengthen their market position in the industry [1][2]. Group 1: Patent Application - SMIC has applied for a patent titled "Semiconductor Structure and Its Formation Method," with publication number CN120035224A, filed on November 2023 [1]. - The patent describes a semiconductor structure that includes a substrate with an insulating layer and an active region, featuring gate structures that enhance ESD (Electrostatic Discharge) robustness and provide bidirectional ESD protection [1]. Group 2: Company Overview - SMIC Beijing was established in 2002, focusing on manufacturing for computers, communications, and other electronic devices, with a registered capital of 100 million USD [2]. - SMIC Shanghai was founded in 2000, also in the same industry, with a registered capital of 244 million USD [2]. - SMIC Beijing has participated in 51 bidding projects and holds 5000 patent records, while SMIC Shanghai has engaged in 127 bidding projects and also possesses 5000 patents [2].