Kinwong(603228) 巨潮资讯· Ju Chao Zi Xun·2025-05-27 02:52Core Viewpoint - Jingwang Electronics has announced a delay in the completion of its HDI project while maintaining the original investment structure and purpose of the raised funds [2][3] Group 1: Project Details - The HDI project aims to produce 600,000 square meters of high-density interconnect printed circuit boards and began construction in Q4 2019, with partial production starting in June 2021 [3] - The total investment in the HDI project as of April 30, 2025, is RMB 210,671.52 million, with RMB 80,304.44 million from raised funds and RMB 130,367.08 million from the company's own funds, representing 81.43% of the committed total investment [2] Group 2: Fundraising and Financials - On April 4, 2023, the company issued 11.54 million convertible bonds at a face value of RMB 100 each, raising a total of RMB 115,400 million, with a net amount of RMB 113,961.54 million after deducting issuance costs [2] - The raised funds are allocated for the construction of the first phase of the HDI project at Jingwang Electronics Technology (Zhuhai) Co., Ltd. [2] Group 3: Strategic Considerations - The company has decided to delay the full completion of the HDI project from June 2025 to June 2026 to mitigate investment risks and enhance the efficiency of fund utilization, considering the macroeconomic environment and industry conditions [3]