Summary of Conference Call Records Industry Overview - The conference call focuses on the AI server and PCB (Printed Circuit Board) industry, particularly the advancements in materials and technology related to AI platforms and their components. Key Points AI Platform Upgrade - The new generation AI server architecture has shifted from "mid-board + CP board" to "switch backplane/orthogonal backplane + computing board," significantly increasing the requirements for backplane layers and material performance [1] - The Virtuoso cabinet inherits the GB300 design and upgrades materials, resulting in a 2x increase in PCB value, with each unit requiring 5 LPU cabinets and 1 CPU cabinet, all needing high-end PCBs [1] - This architectural adjustment is expected to increase PCB quantity by 2-3 times and value by 4-5 times, leading to a substantial rise in demand for copper-clad laminates (CCL) [1] Production Timeline - Core product mass production timelines are set: Rubin is expected to start mass production in Q3 2026, with PCB/CCL materials confirmed by late Q2 to early Q3; Alt in Q4 2026; and Fermi in the second half of 2027, with design completion in 2026 [1] Material Demand and Certification - M9 and M10 materials are projected to see explosive demand, with M9 CCL demand reaching millions of units by 2026 and increasing to 20-30 million units by 2027 alongside the Rubin platform [2] - M10 material certification has begun, with Nvidia requiring a loss factor (Df) of 0.0003. The competitive materials include PTFE (best electrical performance) and hydrocarbon resin + M10 filler, with PTFE outperforming M9 by 20%-30% [2] - M9 solutions have been confirmed, utilizing either "hydrocarbon resin + Q fabric" or "PTFE + fiberglass-free fabric," with a stable yield of 90% for M9 CCL, ready for mass production [2] Supply Chain and Pricing - The supply side is highly concentrated, with CTE fabric currently in severe shortage, priced at 120 RMB/kg, expected to rise further in 2026. New production capacity is anticipated to be released in the second half of 2026 [3] - Q fabric is primarily supplied by Asahi Kasei and domestic suppliers, with domestic prices 20%-30% lower than overseas [3] - Price increases for CCL are expected in 2025 due to rising costs of glass fabric and copper foil, with a projected 20%-30% increase in prices being passed down to end-users by April 2026 [3] PCB Market Dynamics - Due to the surge in PCB demand and value, existing suppliers are unable to meet capacity, prompting Nvidia to onboard new suppliers to ensure supply and reduce costs, with 2-4 suppliers per material number [4] - Key suppliers for LPU and CPU boards are identified, with a notable shift in market share towards new entrants like Jingwang Electronics and Dongshan Precision, while traditional players like Shenghong Technology see a decline in market share despite increased absolute order volumes [4] Copper Foil Specifications - Specifications for copper foil are being upgraded in line with material advancements, with M9 requiring HVP4 copper foil and M10 requiring HVP5/HVP6, with demand for HVP4 expected to reach 8,000-30,000 tons by 2027 [4] - Domestic manufacturers like Tongguan and Longdian Huaxin are accelerating the replacement of foreign suppliers due to price advantages [4] Market Potential - The market potential for CCL is significant, with GB300 cabinets requiring 50 CCLs and 60 PPs, while Rubin Ultra cabinets require 200 CCLs and 240 PPs. The value of core products is highlighted, with LPU boards valued at 20,000-30,000 RMB each and next-generation switch backplanes exceeding 800,000 RMB [5] - The global demand for M9 CCL is projected to reach 20-30 million units by 2027, corresponding to an area of over 20 million square meters, indicating a market size of several billion RMB [5] - Key beneficiaries across various segments are identified, including Shengyi Technology in CCL, Feilihua in electronic fabric, Jingwang Electronics in PCB manufacturing, and Tongguan Copper Foil in copper foil [5]

文/梧桐兄弟 近 日 ，证监会公布了境外发行上市备案补充材料要求（2026年3月16日—2026年3月20日） 、 （2026年3月3日—2026年3月13日），对众安信科 、杭州嘉因、迦智科技、钱大妈、沃客非凡、景 旺电子、华沿机器人、傅里叶半导体、 倍通数据 、迪哲医药、泽璟生物、米奥会展、汉得信息、聚和 材料、科大智能、普祺医药 这 16 家企业出具补充材料要求。 就 倍通数据 ，补充材料要求关注到： 关于股权架构搭建及返程并购的合规性。 请说明（1）持股5% 以上的股东是否履行《关于境内居民通过特殊目的公司境外投融资及返程投资外汇管理有关问题的通 知》（37号文）的外汇登记，以及境内机构股东是否履行对外投资等境内监管程序； （ 2）红筹架构 搭建过程中，涉及收购境内主体的，请提供被收购境内主体收购前后股权架构及穿透情况，说明交易对 价、定价依据、税费缴纳、及倍通医药科技于2024年6月及2025年9月评估值等情况， 是否符合《关 于外国投资者并购境内企业的规定》，外商投资企业收购倍通医药科技相关股权转让价格低于2024年6 月评估值的原因， 是否存在低价将境内资产转移至境外的情况； （3）股权架构搭建 ...

Core Insights - The demand for PCB is driven by scale, speed, and integration, with a focus on the progress of substrate integration, backplane development, and optical-copper fusion [3][6] - The data center PCB market is projected to grow from $12.5 billion in 2024 to $23 billion by 2030, with a CAGR of 10.7% from 2024 to 2030 [13] - Key technological advancements include substrate integration with CoWoP, backplane applications in Kyber racks, and the integration of optical systems in EOCB [18][23][34] PCB Sector - The expansion of computing clusters is leading to increased demand for high-layer, high-density, and high-speed interconnect PCBs [6][12] - The integration of complex functions through substrate and backplane technologies is enhancing PCB capabilities [6][12] - The introduction of CoWoP technology by Nvidia aims to improve signal integrity and reduce power loss, although challenges remain in mSAP process and supply chain constraints [18][19] CCL Sector - The transition to M9-M10 specifications is driven by the need for higher speed and cost-driven price increases [5][37] - The dielectric performance of CCL must be upgraded to ensure signal integrity as speeds and frequencies increase [5][37] - The main materials for CCL are expected to see significant price increases due to supply constraints and rising demand from AI applications [58][63] Key Companies - Key players in the PCB sector include Huadian Co., Shennan Circuit, Shenghong Technology, and others, with a focus on high-layer and high-density PCB production [76] - Huadian Co. is a core supplier for switches and ASIC PCBs, while Shennan Circuit leads in data communication PCBs and packaging substrates [76] - Shenghong Technology is involved in Nvidia's interconnect definitions, focusing on capacity expansion and breakthroughs in ASIC and switch technologies [76] Investment Opportunities - The report highlights the importance of monitoring the progress of high-speed CCL certification and the sustainability of price increases [3][5] - Companies like Huadian Co. and Shenghong Technology are positioned to benefit from advancements in AI and high-speed interconnect technologies [76] - The focus on high-end materials and technologies in the PCB and CCL sectors presents significant investment opportunities as demand continues to rise [58][63]

证券代码：603228 证券简称：景旺电子 公告编号：2026-007 深圳市景旺电子股份有限公司 关于为子公司提供担保的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 担保对象及基本情况 | 被担保人名称 | 本次担保金额 | 0.50 | 江西景旺精密电路有限公司 亿元 | | | | --- | --- | --- | --- | --- | --- | | 实际为其提供的担保金 | | 25.80 | 亿元（含 | 亿元共用额度） 10.00 | 担保对象一 | | 额（不含本次） | | （注 | 1） | | | | 是否在前期预计额度内 | | 是 | □否 | □不适用：_________ | | | 本次担保是否有反担保 | | □是 | 否 | □不适用：_________ | | 注 1：公司向宁波银行股份有限公司深圳分行申请了最高额度为 10.00 亿元的综合授信业务， 授信额度由公司与部分子公司共同使用，公司为前述子公司在授信额度范围内提供连带责任 担保。具体详见公司于 ...

Group 1 - The A-share market saw a collective decline in CPO concept stocks, with New Yisheng dropping by 7% [1] - Zhongji Xuchuang, Taicheng Guang, and Changxin Bochuang experienced declines exceeding 6% [1] - Zhili Fang and Dekeli fell by more than 5%, while Shijia Guangzi, Cambridge Technology, Guangku Technology, Jingwang Electronics, and Robotech dropped over 4% [1] - Lian Te Technology, Huilv Ecology, and Juguang Technology saw declines of more than 3% [1]

Core Viewpoint - The CPO concept stocks in the A-share market experienced a collective decline, with significant drops in several key stocks on February 27, indicating a bearish trend in this sector [1]. Group 1: Stock Performance - Xinyisheng (新易盛) fell by 7.02%, with a total market capitalization of 35.67 billion and a year-to-date decline of 16.72% [2]. - Zhongji Xuchuang (中际旭创) decreased by 6.40%, having a market cap of 59.51 billion and a year-to-date drop of 12.20% [2]. - Taichengguang (太辰光) saw a decline of 6.34%, with a market value of 30.6 billion and a year-to-date increase of 16.48% [2]. - Changxin Bochuang (长芯博创) dropped by 6.16%, with a market cap of 43 billion and a year-to-date increase of 3.74% [2]. - Zhili Fang (智立方) decreased by 5.54%, with a market capitalization of 10.1 billion and a year-to-date increase of 67.18% [2]. - Dekeli (德科立) fell by 5.41%, with a market cap of 25.5 billion and a year-to-date increase of 16.96% [2]. - Shijia Guangzi (仕佳光子) declined by 4.88%, with a market value of 37.8 billion and a year-to-date drop of 5.77% [2]. - Cambridge Technology (剑桥科技) decreased by 4.86%, with a market cap of 36.3 billion and a year-to-date drop of 23.31% [2]. - Guangku Technology (光库科技) fell by 4.38%, with a market value of 40.6 billion and a year-to-date increase of 10.83% [2]. - Jingwang Electronics (景旺电子) saw a decline of 4.28%, with a market cap of 65.3 billion and a year-to-date drop of 9.34% [2]. - Robot Technology (罗博特) decreased by 4.19%, with a market value of 63.7 billion and a year-to-date increase of 62.91% [2]. - Liante Technology (联特科技) fell by 3.64%, with a market cap of 23.8 billion and a year-to-date increase of 8.70% [2]. - Huilv Ecology (汇绿生态) decreased by 3.03%, with a market value of 23.4 billion and a year-to-date increase of 36.03% [2]. - Juguang Technology (炬光科技) fell by 3.01%, with a market cap of 33.2 billion and a year-to-date increase of 111.22% [2]. - Tiantong Co. (天通股份) decreased by 2.96%, with a market value of 21 billion and a year-to-date increase of 29.78% [2]. - Tianfu Communication (天孚通信) fell by 2.53%, with a market cap of 274.3 billion and a year-to-date increase of 73.80% [2]. - Changjia Technology (长甲科技) decreased by 2.32%, with a market value of 85.2 billion and a year-to-date increase of 29.39% [2].

Group 1 - The core point of the news is that Jingwang Electronics experienced a stock price increase of 5.06%, reaching 64.19 CNY per share, with a trading volume of 1.038 billion CNY and a turnover rate of 1.68%, resulting in a total market capitalization of 63.215 billion CNY [1] - Jingwang Electronics, established on March 9, 1993, and listed on January 6, 2017, is primarily engaged in the research, production, and sales of printed circuit boards, with 94.67% of its revenue coming from this main business and 5.33% from other supplementary sources [1] Group 2 - The Oriental Alpha Fund holds a significant position in Jingwang Electronics, with its Oriental Alpha Advantage Industry Mixed A Fund (009644) owning 2.4806 million shares, accounting for 6.1% of the fund's net value, making it the sixth-largest holding [2] - The Oriental Alpha Advantage Industry Mixed A Fund was established on June 28, 2020, with a current size of 1.594 billion CNY, showing a year-to-date return of 0.43% and a one-year return of 65.17%, ranking 715 out of 8199 in its category [2] Group 3 - The fund managers of the Oriental Alpha Advantage Industry Mixed A Fund are Zhou Mi and Wu Qiushong, with Zhou Mi having a tenure of 7 years and 359 days and a best fund return of 112.22% during his management period [3] - Wu Qiushong has a tenure of 4 years and 355 days, with a best fund return of 35.63% during his management period [3]

Group 1 - The core point of the article is that Jingwang Electronics (603228) has filed an international patent application for a new type of embedded magnetic PCB and its manufacturing method, with the application number PCT/CN2025/080770 and an international publication date set for February 19, 2026 [1] - In 2023, Jingwang Electronics has announced one international patent application so far [1] - The company invested 426 million yuan in research and development in the first half of 2025, representing a year-on-year increase of 28.99% [1]

Investment Rating - The investment outlook for the Chinese electronic components industry is stable, with overall credit quality expected to remain unchanged over the next 12 to 18 months [5][8]. Core Insights - The industry is driven by the recovery in consumer electronics, rapid growth in automotive electronics, and advancements in artificial intelligence, with traditional consumer electronics providing basic demand support but limited impact on overall growth [15][21]. - The industry is expected to gradually transition towards high-end products, with leading companies leveraging their high-end capacity and technological advantages to maintain a competitive edge [15][21]. - The overall credit risk in the electronic components industry is manageable, with no significant changes in ratings and no instances of bond extensions or defaults reported [22]. Industry Fundamentals Analysis - In 2025, domestic policies such as "trade-in" programs effectively boosted demand in the downstream market, helping to stabilize the electronic components industry amid fluctuating international trade conditions and tariff policies [9][11]. - The global competition landscape in the electronic components sector has remained stable, with significant growth in revenue and profits across various sub-sectors, although operating cash flow has declined [7][22]. - The industry is expected to see substantial order growth driven by automotive electronics and AI demand, with potential for upward adjustments in industry outlook if favorable conditions persist [7][8]. Credit Performance of Industry Enterprises - The financial performance of enterprises within the electronic components industry has improved, with revenue and profit growth reported, although operating cash flow has decreased [22][27]. - The average revenue growth for sample enterprises in the electronic components sector was 27.14% year-on-year, with significant contributions from AI-related demands [27][28]. - The debt scale of sample enterprises increased, but the overall financial leverage remains low, indicating good debt repayment capabilities [34][35].

Core Viewpoint - The article discusses the recent developments surrounding Kinwong Electronics, a leading PCB manufacturer in China, as it prepares for its IPO in Hong Kong while its controlling shareholders have been cashing out over 1 billion RMB, raising questions about the company's future prospects [4][40]. Group 1: Company Overview - Kinwong Electronics, established over 30 years ago, has become a global leader in PCB manufacturing, with a market capitalization exceeding 65 billion RMB [3]. - The company has successfully positioned itself as the top supplier of automotive PCBs globally, holding a 9% market share, which is 2.6 percentage points ahead of its nearest competitor [7][9]. Group 2: Financial Performance - Kinwong's revenue has shown steady growth, increasing from 6.33 billion RMB in 2019 to 12.66 billion RMB in 2024, with a compound annual growth rate (CAGR) of nearly 15% [16]. - However, the net profit growth has lagged, with a CAGR of only 6.9% during the same period, indicating a decline in profitability [18]. - The company's gross margin and net margin have decreased by 5.9 percentage points and 4.6 percentage points, respectively, since 2019, with the latest figures at 21.6% and 8.6% [20]. Group 3: Market Position and Competition - Despite being a top player, Kinwong faces intense competition in the PCB industry, with many peers experiencing rising profit margins while Kinwong's margins have fallen [22][23]. - The company’s automotive electronics segment has contributed nearly half of its revenue, solidifying its position but also highlighting the challenges of maintaining high profitability in a highly competitive market [11]. Group 4: Strategic Challenges - Kinwong's focus on automotive PCBs, while lucrative, has limited its ability to capitalize on the rapidly growing AI PCB market, where demand for high-end products is surging [33]. - The company has initiated projects to enhance its capabilities in high-end PCBs, but delays in production timelines have raised concerns about its ability to meet market demands [36][40]. - The controlling shareholders' decision to cash out during this critical transition period raises questions about their confidence in the company's future growth prospects [4][40].