首单民营创投“科创债”落地，15年期总规模15亿元

Core Viewpoint - The launch of the "Technology Board" in the bond market has facilitated the issuance of the first private venture capital "Technology Innovation Bond" by Shenzhen Oriental Fortune Capital, marking a significant step in supporting technology innovation financing [1][2]. Group 1: Bond Issuance Details - Shenzhen Oriental Fortune plans to issue a total of 1.5 billion yuan (approximately 0.21 billion USD) in technology innovation bonds with a maturity of 15 years [1]. - The funds raised will be specifically allocated to venture capital investments and replacements in technology innovation sectors, focusing on strategic emerging industries such as artificial intelligence, digital economy, new energy, new materials, semiconductors, and biomedicine [1]. Group 2: Market Context and Challenges - The venture capital industry faces a common challenge of "difficulty in fundraising," particularly for private venture capital institutions due to their smaller scale, weaker risk resistance, and limited brand influence [1]. - Historically, private venture capital institutions have shown limited enthusiasm for issuing bonds to supplement capital due to high issuance rates stemming from low ratings, mismatched bond and fund durations, and low guarantee limits with high costs [1]. Group 3: Supportive Measures and Collaboration - The successful launch of the project involved collaboration among various stakeholders, including the Shenzhen Municipal Financial Office, the People's Bank of China Shenzhen Branch, and other market participants [2]. - The introduction of risk-sharing tools for technology innovation bonds aims to provide low-cost, long-term financing support for technology innovation enterprises and equity investment institutions [2]. - The Central Bank's policy to provide low-cost re-lending funds for purchasing technology innovation bonds is expected to channel more long-term, efficient, and low-cost bond funds into the technology innovation sector [2].