Workflow
鸿日达: 东吴证券股份有限公司关于鸿日达科技股份有限公司使用银行承兑汇票、信用证等票据支付募投项目部分款项并以募集资金等额置换的核查意见

Core Viewpoint - The company plans to use bank acceptance bills and letters of credit to pay for part of the fundraising projects and will replace these payments with the raised funds, aiming to improve the efficiency of fund usage and reduce financial costs [1][7][9]. Fundraising Basic Situation - The company raised a total of RMB 75,438.20 million by issuing 51.67 million shares at RMB 14.60 per share, with actual funds received amounting to RMB 67,582.85 million after deducting issuance costs of RMB 7,855.35 million [1][2]. Fundraising Investment Project Situation - The company approved the use of RMB 57 million of excess funds to repay bank loans and made changes to the implementation of fundraising projects without altering the investment direction or total amount [2][3]. - The company has also approved the use of remaining funds from the "Kunshan Hanjing Precision Connector Production Project" for new projects, including "Semiconductor Metal Heat Sink Material Project" and "Automotive High-Frequency Signal Cable and Connector Project" [3][4]. Use of Bills and Letters of Credit - The company intends to use bank acceptance bills and letters of credit for payments, which will be replaced by the raised funds, following an internal approval process to ensure compliance and efficiency [6][7]. Impact on Daily Operations - The use of these financial instruments is expected to lower financial costs and enhance the flexibility of fund usage without affecting the normal progress of fundraising projects [7][9]. Approval Procedures and Opinions - The board and supervisory committee have reviewed and approved the use of bank acceptance bills and letters of credit, confirming that this does not change the direction of the raised funds and supports efficient fund usage [7][8].