又一通信芯片厂商完成数亿元融资！

Core Viewpoint - Jinglue Semiconductor has completed a strategic financing round worth several hundred million RMB, with the investment from Guotou Investment, aimed at accelerating the R&D and mass production of automotive interconnect and switching chips, supporting the domestic substitution strategy in the core areas of automotive intelligence [1] Company Overview - Established in 2009, Jinglue Semiconductor is located in Zhangjiang, Shanghai, and is a domestic provider of automotive Ethernet chips and full-stack solutions for high-speed automotive networks, possessing 100% self-developed intellectual property and experience in mass production of large-scale communication chips [2][5] - The company has completed eight rounds of financing since its inception, with notable investors including Guotou Investment, Dinghui Investment, and CITIC Capital, as well as leading industry capital such as Matrix Partners and SAIC Capital [2] Financing Details - The company has undergone multiple financing rounds, with significant amounts raised, including nearly 100 million USD in the C round in July 2022 and several rounds in 2021 amounting to several hundred million RMB [3][4] - In 2021 alone, Jinglue Semiconductor completed three financing rounds within eight months, with the B and B++ rounds each raising several hundred million RMB [4] Product Development - Jinglue Semiconductor has successfully mass-produced various PHY and Switch chips, including the first domestic automotive gigabit Ethernet PHY chip, achieving AEC-Q100 automotive certification and maintaining a zero-defect quality record [5] - The company has recently achieved the first mass production of 32G high-speed SerDes IP using SMIC's 28nm process, expanding applications in AI and data center high-speed interconnect chips [6] Strategic Partnerships - In August 2021, Jinglue Semiconductor formed a joint venture with Weir Shares to collaborate on automotive vision technology, focusing on high-speed image data transmission and processing solutions for next-generation smart vehicles [7]