Workflow
博敏电子: 博敏电子关于部分募投项目延期的公告

Core Viewpoint - The company has announced a delay in the completion date of its fundraising project "Bomin Electronics New Generation Electronic Information Industry Investment Expansion Project (Phase I)" from July 2025 to December 31, 2026, without changing the project's implementation subject, method, investment scale, or purpose [1][6][8]. Fundraising Overview - The company raised a total of RMB 150,000.00 million by issuing 12,701.10 million shares at a price of RMB 11.81 per share, with a net amount of RMB 147,348.60 million after deducting issuance costs [2][5]. - The funds are managed through a dedicated account to ensure proper oversight and protection of investor rights [3][5]. Project Details - The project aims to increase production capacity by 1.72 million square meters per year for high-end PCB products, which are essential for AI servers, network communications, automotive electronics, industrial control medical devices, and energy storage [6][7]. - The project is designed to be implemented in phases, allowing for adjustments based on market demand and resource allocation [7]. Delay Reasons - The delay is attributed to the project's high level of automation, customized equipment, and complex production processes, as well as the need to align with current capacity demands and new project orders [6][7]. Impact of Delay - The delay will not materially affect the project's implementation or the company's normal operations, and it aligns with the company's long-term development strategy [8][9]. - The company has received approval from its audit committee, supervisory board, and sponsor, confirming that the delay does not harm shareholder interests [9].