Core Viewpoint - The company has decided to extend the timeline for the "Technology Reserve Fund Project" to December 2026, without changing the project’s implementation subject, method, or funding usage, ensuring no substantial impact on the project’s execution [1][3][4] Fundraising Overview - The company issued convertible bonds totaling RMB 380 million on June 28, 2023, with a net amount of RMB 371.09 million after deducting issuance costs [1][2] - The funds are allocated for projects including smart photovoltaic and battery management PLC chip R&D, and smart home multi-mode communication gateway and device PLC chip R&D [2] Project Delay Details - The original expected date for the "Technology Reserve Fund Project" to reach a usable state was June 2025, which has now been postponed to December 2026 [2][3] - The delay is based on the actual progress of the project and aims to align with the company's long-term development strategy [3] Impact of Delay - The delay is a prudent decision based on the project's actual situation and does not alter the investment direction or harm shareholder interests [3][4] - The project’s implementation will continue as planned, adhering to regulatory requirements and ensuring no adverse effects on the company or its shareholders [4] Approval Process - The board of directors approved the extension during a meeting on June 13, 2025, with no need for shareholder approval as confirmed by the sponsor, CITIC Securities [4]
力合微: 关于部分募投项目延期的公告