天眼查商业履历信息显示，深圳市力合微电子股份有限公司，成立于2002年，位于深圳市，是一家以从 事软件和信息技术服务业为主的企业。企业注册资本12117.738万人民币，实缴资本12065.7438万人民 币。公司法定代表人为LIU KUN。 通过天眼查大数据分析，深圳市力合微电子股份有限公司共对外投资了5家企业，参与招投标项目278 次，知识产权方面有商标信息22条，专利信息147条，此外企业还拥有行政许可11个。 来源：金融界 金融界消息 截至2025年8月12日收盘，力合微（688589）报收于24.27元，上涨0.04%，换手率3.13%， 成交量4.55万手，成交金额1.10亿元。 资金流向方面，今日主力资金净流出1076.74万元，占比成交额9.82%。其中，超大单净流出252.07万 元、占成交额2.3%，大单净流出824.67万元、占成交额7.52%，中单净流出流入428.42万元、占成交额 3.91%，小单净流入648.32万元、占成交额5.91%。 力合微最新一期业绩显示，截至2025一季报，公司营业总收入9778.77万元、同比减少24.70%，归属净 利润1259.32万元，同比减少4 ...

一、开立募集资金理财产品专用结算账户情况 | 证券代码：688589 | 证券简称：力合微 | 公告编号：2025-042 | | --- | --- | --- | | | 债券简称：力合转债 | | | 债券代码：118036 | | | 深圳市力合微电子股份有限公司 关于开立募集资金理财产品专用结算账户的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 深圳市力合微电子股份有限公司（以下简称"公司"）于2024年12月30日 召开第四届董事会第十七次（临时）会议、第四届监事会第十二次（临时）会 议，审议通过了《关于使用部分闲置募集资金及自有资金进行现金管理的议 案》，同意公司在保证不影响公司募集资金投资计划正常进行的前提下，使用 不超过人民币5亿元（含本数）闲置募集资金进行现金管理（包括但不限于结构 性存款、协定存款、通知存款、定期存款、大额存单、收益凭证等），使用期 限为2025年1月1日至2025年12月31日（不超过12个月），在前述额度及期限范 围内，可循环滚动使用。具体内容详见公司于2024年12月31 ...

Core Viewpoint - The company, Lihui Microelectronics (力合微), is focusing on maintaining a strong R&D investment to ensure its competitive edge in the IoT communication and chip design sectors, despite facing challenges in revenue and profit in the first quarter of 2025 [1][4]. R&D Investment and Personnel - Lihui Microelectronics has maintained a high level of R&D investment, totaling 89.02 million yuan in 2024, representing an 8.59% year-on-year increase [2]. - The company employs 182 R&D personnel, accounting for 57.59% of its total workforce, emphasizing its commitment to innovation and product development [2]. - The company has developed significant proprietary technologies, including advanced digital communication and low-power chip design technologies, which have established a competitive advantage in the market [2]. Product Development in Photovoltaics - The company has developed products for the photovoltaic market, including a rapid shutdown chip that complies with the North American SUNSPEC protocol, becoming the first in China to receive international certification [3]. - Lihui Microelectronics has also launched a narrowband PLC SOC chip for the European market, meeting EN50065-1 standards, and has implemented a monitoring and safety shutdown system for rooftop photovoltaic components [3]. Financial Performance - In Q1 2025, the company reported revenue of 97.79 million yuan, a decrease of 24.70% year-on-year, primarily due to the impact of bidding and supply rhythms in the smart grid market [4]. - The net profit attributable to shareholders was 12.59 million yuan, down 46.08% year-on-year, reflecting the decline in revenue [4]. - The company’s non-grid business generated revenue of 32.24 million yuan in 2024, a growth of 39.81% year-on-year, indicating progress in the non-power IoT market [5]. Order Backlog and Revenue Recognition - As of the end of March 2025, the company had an order backlog of 9.3 billion yuan, which is expected to be recognized as revenue within the same year, depending on the delivery and acceptance schedules of the power companies [6].

Core Points - The company has issued convertible bonds named "力合转债" with a total amount of 380 million yuan, which began trading on July 20, 2023 [2][4] - The conversion period for the bonds is from January 4, 2024, to June 27, 2029, with an initial conversion price set at 43.78 yuan per share [2][4] - As of June 30, 2025, only 906 shares have been converted from the bonds, representing 0.00090% of the total shares before conversion [5] Convertible Bond Issuance Overview - The company received approval from the China Securities Regulatory Commission to issue 3.8 million convertible bonds, each with a face value of 100 yuan, totaling 38 million yuan [1][2] - The bonds are set to mature six years from the issuance date, specifically from June 28, 2023, to June 27, 2029 [1][2] Conversion Status - As of June 30, 2025, the total amount of unconverted bonds stands at 379,967,000 yuan, which accounts for 99.99132% of the total issuance [5] - During the quarter from April 1, 2025, to June 30, 2025, only 1,000 yuan worth of bonds were converted, resulting in 34 shares, which is 0.00003% of the total shares before conversion [4][5] Share Capital Changes - The total share capital before the conversion was 121,177,346 shares, which increased to 145,328,310 shares after accounting for the conversion and other reasons [5] - The company implemented a cash dividend of 3 yuan per 10 shares and a capital reserve increase of 2 shares for every 10 shares held, contributing to the increase in total share capital [5]

| 证券代码：688589 | 证券简称：力合微 | 公告编号：2025-041 | | --- | --- | --- | | 转债代码：118036 | 转债简称：力合转债 | | 深圳市力合微电子股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 累计转股情况："力合转债"的转股期间为 2024 年 1 月 4 日至 2029 年 6 月 27 日。截至 2025 年 6 月 30 日，累计已有 33,000 元"力合转债"转换为公 司股票，累计转股数量为 906 股，占"力合转债"转股前公司已发行股份总额 100,570,770 股的 0.00090%。 未转股可转债情况：截至 2025 年 6 月 30 日，尚未转股的"力合转债" 金额为 379,967,000 元，占"力合转债"发行总量的比例为 99.99132%。 本季度转股情况：自 2025 年 4 月 1 日至 2025 年 6 月 30 日，"力合转债" 共有 1,000 元转换为公司股票，转股数量为 34 股，占"力合转债"转股 ...

Core Viewpoint - The company, Lihe Micro (688589), has shown a positive stock performance with a 6.28% increase this week, reflecting a growing interest in its operations and market positioning in the semiconductor sector [1]. Group 1: Company Performance - As of June 27, 2025, Lihe Micro's stock closed at 21.14 yuan, up from 19.89 yuan the previous week, with a market capitalization of 3.072 billion yuan, ranking 154th in the semiconductor sector [1]. - The company reported an order backlog of 193 million yuan as of March 31, primarily focused on power grid-related business, with revenue recognition expected within the same year based on delivery and acceptance schedules [5]. Group 2: Strategic Development - The company plans to expand into non-power grid sectors, focusing on opportunities in digital economy, "dual carbon" initiatives, smart photovoltaic, energy storage, and smart home applications [2]. - Lihe Micro is developing a series of chips for photovoltaic and smart home applications, including PLC dual-mode chips and highly integrated PLC chips for monitoring and safety [2]. Group 3: Technology and Cost Efficiency - PLC technology offers significant advantages over traditional smart control products in terms of installation, maintenance, reliability, and cost-effectiveness, particularly in large and cross-space applications [3]. - The company aims to leverage its established technology and brand advantages in PLC chips to create a leading PLC technology ecosystem [2]. Group 4: Financial Management - The company is focused on enhancing its core competitiveness and maintaining shareholder value through effective market management strategies [4]. - Lihe Micro will pay interest on its convertible bonds on June 30, 2025, with a total issuance of 380,000 bonds at a face value of 100 yuan each, amounting to 38 million yuan [6].

证券代码：688589 证券简称：力合微 转债代码：118036 转债简称：力合转债 中信证券股份有限公司 关于深圳市力合微电子股份有限公司 向不特定对象发行可转换公司债券 受托管理事务报告 （2024 年度） 发行人 深圳市力合微电子股份有限公司 （住所：深圳市南山区西丽街道高新技术产业园清华信息港科研楼 11 楼 1101） 债券受托管理人 中信证券股份有限公司 （住所：广东省深圳市福田区中心三路8号卓越时代广场（二期）北座） 2025 年 6 月 第一节 本次可转换公司债券概况 重要声明 本报告依据《公司债券发行与交易管理办法》（以下简称《管理办法》）、 《公司债券受托管理人执业行为准则》（以下简称《执业行为准则》）及其它相关 信息披露文件以及深圳市力合微电子股份有限公司（以下简称" 发行人"或"公 司"）出具的相关说明文件和提供的相关资料等，由受托管理人中信证券股份有限 公司（以下简称"中信证券"或 "受托管理人"）编制。中信证券编制本报告的 内容及信息均来源于发行人对外公布的《深圳市力合微电子股份有限公司 2024 年 年度报告》等相关公开信息披露文件、发行人提供的资料或说明以及第三方中介机 构出具 ...

Core Points - The company issued convertible bonds totaling 380,000 units with a total value of 38 million yuan, with a maturity period of six years from June 28, 2023, to June 27, 2029 [1][2] - The coupon rates for the bonds are set to increase over the years, starting from 0.30% in the first year to 2.50% in the sixth year [1][2] - The initial conversion price for the bonds is set at 43.78 yuan per share, which has been adjusted to 43.72 yuan due to stock incentive plan registrations [2][3] - The conversion price will further adjust to 36.15 yuan on May 23, 2024, and to 29 yuan on February 28, 2025, reflecting the company's actions regarding stock incentives and annual profit distribution [3][4] Bond Payment Details - The interest payment for the bonds will occur annually, with the next payment scheduled for June 30, 2025, covering the period from June 28, 2024, to June 27, 2025 [5][6] - The interest rate for the second year is set at 0.50%, resulting in a payment of 0.50 yuan per bond (before tax) [5][6] - The payment will be made to all registered bondholders as of June 27, 2025, through designated financial institutions [6][7] Tax Implications - Individual investors are subject to a 20% tax on interest income, resulting in a net payment of 0.40 yuan per bond after tax [7][8] - Non-resident enterprises are exempt from corporate income tax on bond interest income until December 31, 2025, allowing them to receive the full interest amount [8]

| 证券代码：688589 | 证券简称：力合微 | 公告编号：2025-040 | | --- | --- | --- | | 转债代码：118036 | 转债简称：力合转债 | | 深圳市力合微电子股份有限公司 关于"力合转债"付息的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 可转债付息债权登记日：2025 年 6 月 27 日 可转债除息日：2025 年 6 月 30 日 可转债兑息日: 2025 年 6 月 30 日 深圳市力合微电子股份有限公司（以下简称"公司"）于2023年6月28日发 行的可转换公司债券将于2025年6月30日（原付息日2025年6月28日为休息日，顺 延至下一交易日）开始支付自2024年6月28日至2025年6月27日期间的利息。根据 《深圳市力合微电子股份有限公司向不特定对象发行可转换公司债券募集说明 书》（以下简称"《募集说明书》"）有关条款的规定，现将有关事项公告如下： 一、可转债发行上市概况 （一）可转债发行情况 根据中国证券监督管理委员会《关于同意深圳市力合微 ...

Core Viewpoint - The company has decided to extend the timeline for the "Technology Reserve Fund Project" to December 2026, without changing the project’s implementation subject, method, or funding usage, ensuring no substantial impact on the project’s execution [1][3][4] Fundraising Overview - The company issued convertible bonds totaling RMB 380 million on June 28, 2023, with a net amount of RMB 371.09 million after deducting issuance costs [1][2] - The funds are allocated for projects including smart photovoltaic and battery management PLC chip R&D, and smart home multi-mode communication gateway and device PLC chip R&D [2] Project Delay Details - The original expected date for the "Technology Reserve Fund Project" to reach a usable state was June 2025, which has now been postponed to December 2026 [2][3] - The delay is based on the actual progress of the project and aims to align with the company's long-term development strategy [3] Impact of Delay - The delay is a prudent decision based on the project's actual situation and does not alter the investment direction or harm shareholder interests [3][4] - The project’s implementation will continue as planned, adhering to regulatory requirements and ensuring no adverse effects on the company or its shareholders [4] Approval Process - The board of directors approved the extension during a meeting on June 13, 2025, with no need for shareholder approval as confirmed by the sponsor, CITIC Securities [4]