TKGF(SH:601233) Shang Hai Zheng Quan Bao·2025-06-13 20:38Group 1 - The company, Tongkun Group Co., Ltd., has announced the issuance of its fourth phase of technology innovation bonds for the year 2025, with a total issuance amount of 500 million yuan [2] - The funds raised from this bond issuance were fully received by June 12, 2025 [2] - The relevant documents for this bond issuance have been published on the China Money website and the Shanghai Clearing House website [2] Group 2 - On April 25, 2024, the company's board approved a proposal to issue short-term financing bonds, which was subsequently approved by the shareholders' meeting on May 21, 2024 [1] - The company has been authorized to apply for the registration of short-term financing bonds not exceeding 6 billion yuan [1] - The registration for the short-term financing bonds was accepted by the trading association on August 30, 2024, with a registered amount of 6 billion yuan, valid for two years [1]