Group 1 - The company announced a delay in the completion date of the "Bomin Electronics New Generation Electronic Information Industry Investment Expansion Project (Phase I)" from July 2025 to December 31, 2026 [2][3] - The total investment for the project is approximately 2.13 billion yuan, with 1.15 billion yuan planned to be raised through stock issuance [2] - As of the end of May this year, the cumulative investment from raised funds amounts to approximately 828.65 million yuan, with remaining usable funds of approximately 326.94 million yuan, achieving a completion rate of 73.76% [2] Group 2 - The project employs a construction and production approach, originally planned for a three-year construction period, with full construction expected to commence after fundraising in the second quarter of 2023 [2] - The project aims to add a production capacity of 1.72 million square meters per year for high-end PCB products, which will be used in AI servers, network communications, automotive electronics, industrial control medical, and energy storage [2] - The company decided to extend the construction period to better adapt to market demand, optimize resource allocation, and ensure that new capacity aligns with future market needs [3]
建设进度不及预期,博敏电子拟将高端PCB募投项目延期至明年底建成