华为新专利曝光，或开发全新先进封装技术

Group 1 - Huawei's recent patent application for a "four-chip" packaging design has garnered attention, potentially resembling NVIDIA's Rubin Ultra architecture, indicating Huawei's commitment to developing advanced packaging technology [1] - The Guangzhou Development Zone has issued policies to support the high-quality development of the integrated circuit industry, aiming to establish a core area for China's integrated circuit sector [1] - Advanced packaging technology is seen as a crucial method to enhance chip performance and reduce costs, particularly for AI training chips and automotive-grade SoCs, with major domestic packaging and wafer factories improving 2.5D packaging processes and expected to scale up production in the second half of the year [1] Group 2 - The advanced packaging materials market is characterized by high technical barriers and is largely dominated by foreign companies, but the domestic production of these materials is expected to accelerate due to the shift of global semiconductor capacity to China and considerations of supply chain security and cost control [2] - Key companies in the advanced packaging sector include Changdian Technology, Weicai Technology, Yongxi Electronics, and Huada Technology, indicating a competitive landscape in the industry [3]