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中信建投:端侧AI爆发可期 国产高端产能亟需突破
Zhi Tong Cai Jing·2025-06-18 03:41

Group 1 - The commercialization of edge AI applications is accelerating, with rapid increases in penetration rates for AI smartphones and AIPC, as well as AI upgrades in smart cars, robots, wearables (XR, AI glasses, headphones), and smart homes [1] - The demand for computing power is growing rapidly due to the fast iteration of AI, leading to increased needs for advanced processes, advanced packaging, and advanced storage, prompting manufacturers to expand production [1][2] - By 2025, two major themes to focus on are AI computing power and domestic semiconductor substitution [1] Group 2 - The significant reduction in computing costs is catalyzing the demand for inference, with edge AI expected to experience explosive growth [2] - The release of Deepseek's R1, which rivals OpenAI's o1, has demonstrated substantial cost reductions, providing a foundation for breakthroughs in inference applications [2] - The demand for AI hardware is expanding, with the release of Nvidia's GB200 and self-developed ASICs by CSPs, and the next-generation GB300 set to enter mass production [2] Group 3 - Edge AI is beginning to accelerate, with terminal shipments expected to see explosive growth [3] - The advantages of edge AI in terms of cost, energy consumption, reliability, privacy, security, and personalization are now established, leading to a new wave of innovation in terminal devices [3] - The AI penetration rates for smartphones and PCs are projected to reach 18% and 32% respectively by 2024, with continuous upgrades in hardware [3] Group 4 - The current semiconductor cycle is primarily driven by AI demand, with significant growth in infrastructure needs for computing power due to the evolution of large models [4] - The AI transition to edge devices is rapidly advancing, benefiting upstream hardware sectors such as GPU/SoC, storage, PCB, and manufacturing [4] - Domestic semiconductor production faces challenges in high-end capacity, with a need for breakthroughs in advanced manufacturing and packaging technologies [4]