FCSC(SZ:002797) Zheng Quan Zhi Xing·2025-06-18 10:45Core Viewpoint - The announcement details the public issuance of a technology innovation corporate bond by the company, aimed at professional investors, with specific terms and conditions outlined for the bond listing on the Shenzhen Stock Exchange [1] Group 1: Bond Details - The bond is named "2025 Technology Innovation Corporate Bond (First Phase)" and is abbreviated as "25 Yi Chuang K1" [1] - The total issuance amount is 5 billion yuan [1] - The bond has a maturity of 3 years, with a fixed annual interest rate of 1.96% [1] - Interest payments will be made annually, with the first issuance date set for June 12, 2025, and the maturity date on June 12, 2028 [1] Group 2: Listing Information - The bond will be listed on the Shenzhen Stock Exchange starting June 19, 2025, and will be available for trading among institutional investors [1] - The bond's face value is set at 100 yuan per bond, with an opening reference price also at 100 yuan per bond [1] Group 3: Credit Rating - The issuer has received a credit rating of AAA for both the entity and the bond from Dagong Global Credit Rating Co., Ltd [1]