「毅」新闻 | 毅达资本领投衡封新材Pre-B轮融资，加速半导体封装核心材料国产化

Core Insights - Yida Capital has completed an investment in Shanghai Hengfeng New Material Technology Co., Ltd, which will enhance the company's product supply system and strategic layout in the electronic-grade specialty phenolic resin and specialty phenolic epoxy resin markets [1][3] Company Overview - Hengfeng New Material was established in 2018 and is a domestic manufacturer of core materials for semiconductor packaging, with a team that has over 20 years of experience in the phenolic resin and epoxy resin industry [1][3] - The company aims to become a global leader in electronic-grade specialty phenolic resin and specialty phenolic epoxy resin technology, guided by its forward-looking development strategy of "Polymer Technology, Sealing the Future" [1][3] Market Demand and Strategy - There is a significant demand for electronic-grade specialty phenolic resin and specialty phenolic epoxy resin in China, which heavily relies on imports, making the realization of "China Intelligent Manufacturing" urgent [3] - Hengfeng New Material is actively seeking growth points for product localization and has a product matrix widely used in various applications such as copper-clad laminates, epoxy encapsulants, photoresists, electronic adhesives, and other composite materials, receiving high recognition from leading domestic and international companies [3] Production Capacity and Future Plans - The company has established modern production lines in Anhui and Taizhou and plans to accelerate the localization process of electronic-grade specialty phenolic resin and specialty phenolic epoxy resin [3] - The production base in Bengbu, Anhui, is set to commence operations, which is expected to provide sufficient capacity assurance for customers and continuously create maximum value for shareholders and clients [3] Team and Management - The founding team and core members of Hengfeng New Material have extensive experience working in foreign enterprises, possessing rich technical expertise and a broad customer base [4] - The company's products are critical materials in the semiconductor packaging field, with high technical barriers for high-end products, aligning with the trend of domestic substitution [4] - There is an emphasis on cash flow management during the expansion process and on maintaining product quality during the ramp-up of production capacity, ensuring steady progress in the localization of core materials for semiconductor packaging [4]