GoerTek(SZ:002241) Zheng Quan Zhi Xing·2025-06-19 10:59Group 1 - The company, GoerTek Inc., has successfully issued its first phase of technology innovation bonds for the year 2025, with a total issuance amount of 10 billion RMB [1] - The bonds are categorized as ultra-short-term financing bonds, with a maturity period of 270 days, starting from June 19, 2025, and maturing on March 16, 2026 [1] - The issuance interest rate for the bonds is set at 1.70%, with the issuance price at 100 RMB per 100 RMB face value [1] Group 2 - The bonds were registered and approved by the China Interbank Market Dealers Association, indicating regulatory compliance [1] - The bookrunner and lead underwriter for the bond issuance is Industrial Bank Co., Ltd., with joint lead underwriters including China Merchants Bank Co., Ltd., Zhejiang Merchants Bank Co., Ltd., and Shanghai Pudong Development Bank Co., Ltd. [1] - The funds raised from this bond issuance are intended to support the company's financial planning and operations [1]