WINGTECH(SH:600745) Zheng Quan Zhi Xing·2025-06-20 10:50Overview of the Convertible Bond Issuance - Wintai Technology Co., Ltd. has been approved to publicly issue convertible bonds not exceeding 8.6 billion yuan [1][2] - The bonds, referred to as "Wintai Convertible Bonds," have a maturity of six years and an annual interest rate of 1.80% for the first five years and 2.00% for the sixth year [1][2] Key Terms of the Convertible Bonds - The bonds will pay interest annually, with the first payment starting on July 28, 2021 [1] - The redemption price at maturity will be 108 yuan per bond, including the last interest payment [2] - The company has the right to adjust the conversion price downwards if the stock price falls below 85% of the conversion price for at least 15 out of 30 consecutive trading days [1][2] Financial Performance - In 2024, the company reported a net profit attributable to shareholders of -2.833 billion yuan, a significant decline from a profit of 118 million yuan in 2023 [7][8] - The total revenue for 2024 was approximately 7.36 billion yuan, reflecting a year-on-year increase of 20.23% [8] - The company's total assets at the end of 2024 were approximately 7.50 billion yuan, a decrease of 2.59% compared to the previous year [8] Use of Proceeds from the Convertible Bonds - The company plans to change the use of raised funds, reallocating remaining funds to supplement working capital permanently due to uncertainties in project benefits [9][10] - As of the end of the reporting period, 587.05 million yuan of the raised funds had been utilized, with 50% of the funds being redirected [9][10] Company Background - Wintai Technology operates in the semiconductor and product integration sectors, utilizing an Integrated Device Manufacturer (IDM) model [7] - The company is listed on the Shanghai Stock Exchange under the stock code 600745 and the convertible bond code 110081 [6]