Sou Hu Cai Jing·2025-06-21 11:56Core Viewpoint - Semiconductor manufacturing companies, specifically SMIC, are advancing their technology through new patent applications, indicating a focus on innovation in semiconductor structures and methods [1][2]. Group 1: Patent Application - SMIC has applied for a patent titled "Semiconductor Structure and Its Formation Method," with publication number CN120184119A, filed on December 2023 [1]. - The patent describes a semiconductor structure that includes a first substrate with distinct lead-out areas and surrounding modified areas, which are treated to achieve conductivity [1]. - The method involves forming a device layer on the first surface of the substrate, creating openings that expose parts of the interconnect structure, and implementing a design to reduce leakage current between adjacent lead-out structures [1]. Group 2: Company Overview - SMIC Beijing was established in 2002, focusing on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [2]. - SMIC Beijing has made investments in one company, participated in 51 bidding projects, and holds 5,000 patent records along with 226 administrative licenses [2]. - SMIC Shanghai, founded in 2000, specializes in manufacturing specialized equipment, with a registered capital of 244 million USD [2]. - SMIC Shanghai has invested in four companies, engaged in 127 bidding projects, and possesses 150 trademark records along with 5,000 patent records and 442 administrative licenses [2].