桐昆股份: 桐昆集团股份有限公司关于2025年度第五期科技创新债券发行结果的公告

Group 1 - The company’s board approved the issuance of short-term financing bonds, with a total amount not exceeding 6 billion RMB [1] - The shareholders' meeting scheduled for May 21, 2024, will review and approve the bond issuance proposal [1] - The registration amount for the short-term financing bonds has been accepted by the trading association, totaling 6 billion RMB [1] Group 2 - The company plans to issue a total of 500 million RMB in technology innovation bonds, with the issuance date set for June 23, 2025 [1] - The issuance interest rate for the bonds is set at 1.79% [1] - The main underwriter for the bond issuance is CITIC Bank, with China Everbright Bank as a co-underwriter [1]