Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs

Siemens' new Innovator3D IC solution suite delivers a fast, predictable path for planning and heterogeneous integration, substrate/interposer implementation, interface protocol analysis compliance and data management of designs and design data IP. Built on an AI-infused user experience offering extensive multithreading and multicore capabilities to achieve optimal capacity and performance on 5+ million pin designs, the new Innovator3D IC solution suite is comprised of the Innovator3D IC Integrator, a consol ...