全球顶尖企业家齐聚上海！ 10月12日，第37次上海市市长国际企业家咨询会议在沪举行，华平投资集团全球主席纪杰、高瓴投资创 始人兼首席执行官张磊和贝恩公司全球主席曼尼·马瑟达等在内的全球近40位顶尖企业家，围绕人工智能 （AI）、数据与金融等领域的相关话题，为上海迈向2030年的发展战略建言献策。 应系统性规划AI发展 AI迅猛发展背后，其面临的巨大电力消耗问题备受关注。ABB集团总裁兼首席执行官马腾表示，能够满足 能源飙升需求的国家和地区，将在AI竞赛中占据优势。 贝恩公司全球主席曼尼·马瑟达说，AI与可持续发展结合能为上海提供关键助力，助力上海成为中国乃至世 界发展的典范。他建议上海重点关注AI与绿色转型之间的协同潜力，投资绿色数据中心、芯片设计优化等 技术，成为可持续AI领先者；同时利用AI促进绿色消费，增强消费者的认知，激发可持续的消费意愿。 建议加快跨境数据流动 在人工智能迅速发展过程中，数据的隐私、分享等问题同样不容忽视。 西门子股份公司董事会主席、总裁兼首席执行官博乐仁说，如今，消费级人工智能占据头条，未来，工业 级人工智能将会产生影响，而这就需要工业级人工智能模型。真正可信、可理解的工业级AI ...

Motorcycle company extends technical partnership to further integrate and optimize research and development with Siemens Xcelerator , /PRNewswire/ -- Siemens Digital Industries Software has renewed its technical partnership agreement with Ducati Corse, ("Ducati") for the next two years and detailed how the Siemens Xcelerator platform has been instrumental in helping the company to achieve its mission of creating increasingly powerful, safe and sustainable motorcycles. Siemens Digital Industries Software has ...

Siemens (SIEGY) Weighs Unusual Plan for Healthineers StakeAnother round of round the world spinoff news worth highlighting — from Germany to Canada to the auto sector.Siemens AG (OTC: SIEGY) is reportedly exploring a separation of its ~71% stake in Siemens Healthineers (SHL.DE). Instead of a traditional carveout IPO or straightforward spinoff, Siemens is said to be studying a direct distribution of Healthineers shares to its own shareholders.That approach would be unusual in the German market, where large s ...

该声明由丹麦工业联合会在欧盟领导人非正式会议期间递交给欧盟委员会主席冯德莱恩、法国总统 马克龙、波兰总理图斯克和丹麦首相弗雷泽里克森。 丹麦今年下半年担任欧盟轮值主席国。欧盟领导人非正式会议和欧洲政治共同体领导人会议分别于 10月1日、2日在哥本哈根举行。 相关企业承诺，如果监管和金融环境得到改善，它们准备投入更多资金，到2030年前在欧洲的投资 平均增加50%。 新华社奥斯陆10月1日电（记者 张玉亮）哥本哈根消息：欧洲28家大型跨国企业1日在哥本哈根发 表联合声明，呼吁欧盟出台改革措施，以增强欧洲的竞争力。 这些大型企业包括诺和诺德、西门子、空客、萨博、丹佛斯、蒂森克虏伯、嘉士伯和马士基等。在 一份名为《哥本哈根承诺》的联合声明中，这些企业呼吁欧盟改革现有监管措施，包括简化对企业的管 理规则和报告要求、改革创新和投资框架、改善基础设施、实现公平的绿色转型以及加强安全管理等。 ...

德国联邦外贸与投资署首席执行官尤利娅·布劳娜(JuliaBraune)表示，不断增长的投资规模和成员数量， 充分体现了"为德国制造"倡议的战略意义。国际企业有机会深度参与德国经济，并从中受益。(完) （文章来源：中国新闻网） 德国总理默茨在7月举行的"为德国制造"倡议首次会议上，称该倡议为德国数十年来最大规模的投资计 划之一。当时，倡议企业成员承诺到2028年将在德国投资超6310亿欧元。如今公布的7350亿欧元，涵盖 了既有计划投资、新资本投入、研发支出以及国际投资者的承诺。 中新网柏林10月1日电 (记者马秀秀)"为德国制造"(Made for Germany)倡议企业近日公布，未来三年将投 资大约7350亿欧元，以提振德国经济。 "为德国制造"倡议由西门子、德意志银行等知名企业牵头，自今年夏季以来，成员数量从61家增长至 105家，涵盖跨国公司、中小型企业及初创企业。 ...

上帝之手，西门子高速贴片机，具备微小物料的精准识别和抓取能力 上帝之手，西门子高速贴片 机，具备微小物料的精准识别和抓取能力 上帝之手，西门子高速贴片机，具备微小物料的精准识别和抓取能力。 特别声明：以上文章内容仅代表作者本人观点，不代表新浪网观点或立场。如有关于作品内容、版权或其它问 题请于作品发表后的30日内与新浪网联系。 ...

Core Insights - L&T Technology Services (LTTS) has expanded its partnership with Siemens to develop AI-driven solutions for process engineering and smart manufacturing [1][4] - The collaboration aims to integrate LTTS' AI engineering capabilities with Siemens' digital platforms to facilitate digital transformation across various sectors [2][5] Group 1: Partnership Objectives - The partnership focuses on delivering simulation-based automation and Industrial Internet of Things (IIoT) solutions in sectors such as automotive, transportation, and industrial products [2] - The collaboration seeks to enhance accuracy in system design and promote informed decision-making in manufacturing operations [3][4] Group 2: Strategic Vision - Siemens emphasizes that partnerships are essential for the digital transformation journey of Indian enterprises [3] - Both companies aim to co-create scalable innovations that empower industries to thrive in a rapidly evolving environment [4] Group 3: Sustainability and Innovation - The partnership is part of LTTS' sustainability segment, which includes process engineering and discrete manufacturing [5] - The focus on solutions like Machine & Line Simulation and IIoT Technology aims to provide industries with greater agility and actionable insights [6]

袁家军说，西门子与重庆合作基础坚实、前景广阔，希望双方在数字重庆建设、高端装备制造、绿色低 碳发展、智慧交通建设、人才培养等方面进一步深化务实合作，努力实现高水平互利共赢。 人民财讯9月27日电，据重庆日报消息，9月27日下午，重庆市委书记袁家军，市委副书记、市长胡衡华 会见了西门子股份公司董事会主席、总裁兼首席执行官博乐仁一行。 博乐仁说，西门子期待与重庆携手并进，持续推动高水平合作，进一步释放人工智能赋能产业升级和城 市治理的巨大潜力，更好助力重庆经济社会高质量发展。 ...

Core Viewpoint - Automotive chips are essential for the development of electric and intelligent vehicles, facing challenges such as high reliability requirements, large-scale circuit verification, and stringent functional safety standards [2][14]. Group 1: Quality, Safety, and Reliability Challenges - Automotive chips must meet high-quality testing and zero-defect (0 DPPM) requirements, eliminating defects introduced during manufacturing [4]. - The verification cycle for automotive-grade chips is longer than for consumer-grade chips, requiring rigorous testing certifications like AEC-Q100, which increases design cycle and cost challenges [4]. - The complexity of fault types and testing scales has increased with the development of large-scale integrated circuits, leading to higher testing difficulty, time, and costs [4]. Group 2: Testing Solutions - Siemens EDA's Tessent™ solution helps automotive chip designers ensure high quality, enhance safety, and improve reliability, accelerating time-to-market [4]. - Tessent DFT technology provides high-quality testing to ensure zero defects, generating defect-oriented fault models for comprehensive testing coverage [5]. - Tessent™ LogicBIST and MemoryBIST solutions enable in-chip self-testing capabilities and non-destructive memory testing during system operation, respectively [8]. Group 3: Verification Challenges - Accurate functional verification before chip tape-out is crucial, with increasing complexity in automotive chips making this process more challenging [10]. - The new Veloce™ CS hardware-assisted verification system from Siemens EDA significantly enhances hardware acceleration performance, supporting over 40 billion gates [11]. - Veloce proFPGA CS allows for rapid execution of silicon verification, facilitating firmware and application development [12]. Group 4: Functional Safety Requirements - The performance and safety of chips directly impact driving safety, necessitating compliance with functional safety standards like ISO 26262 [14]. - There is a growing demand for higher safety levels in automotive chips, particularly for ASIL-D level designs related to advanced driver-assistance systems (ADAS) [15]. - Siemens EDA's Austemper platform enhances efficiency in safety analysis and verification, supporting clients in meeting ASIL-B and ASIL-D requirements [15][17]. Group 5: Industry Impact - Automotive chips play an indispensable role in the intelligent and electric transformation of modern vehicles, with Siemens EDA providing advanced solutions to ensure high quality and reliability [17].

Sep 26, 2025 10:22 AM Eastern Daylight Time Siemens Announces Retirement of USA President & CEO Barbara Humpton Share Ann Fairchild appointed Interim President & CEO of Siemens USA WASHINGTON--(BUSINESS WIRE)--Siemens today announced that Barbara Humpton, President and CEO of Siemens USA, will retire from the company effective October 1, 2025. Ann Fairchild, General Counsel for Siemens USA, has been appointed interim President and CEO of Siemens USA effective October 1. During her 14-year tenure with Siemen ...