晶合集成: 晶合集成关于部分募投项目结项并将节余募集资金永久补充流动资金的公告

Core Viewpoint - Hefei Jinghe Integrated Circuit Co., Ltd. has decided to conclude the "40nm Logic Chip Process Platform R&D Project" and permanently supplement its working capital with the remaining funds from the fundraising projects [1][5]. Fundraising Overview - The company raised a total of approximately 9.96 billion RMB through its initial public offering, issuing 501,533,789 shares at a price of 19.86 RMB per share [1]. - The funds were managed in a dedicated account with oversight from the sponsor and the bank [2]. Project Details - The fundraising projects included the "40nm Logic Chip Process Platform R&D Project," which has now been concluded, and the total planned funding for the projects was 9.5 billion RMB [2]. - The company has adjusted its fundraising project plans, with the total amount remaining at 9.5 billion RMB despite changes in specific project allocations [2]. Remaining Funds and Usage - As of June 15, 2025, the remaining funds from the concluded project amount to 353.24 million RMB, which will be used to permanently supplement the company's working capital [5]. - The remaining funds include unspent contract payments and other costs, which will be settled using the company's own funds [4]. Reasons for Surplus Funds - The company has effectively managed its funds, optimizing resource allocation and reducing project implementation costs through the integration of advanced technologies and domestic procurement [4]. - The company also generated some investment income from cash management of idle funds during the fundraising period [4]. Impact of Fund Reallocation - The decision to permanently supplement working capital with surplus funds is aimed at improving the efficiency of fund usage and does not harm the interests of the company or its shareholders [5][6]. - The supervisory board and the sponsor have both expressed their agreement with this decision, confirming compliance with relevant regulations [6][8].