Micron Technology(US:MU) Jing Ji Ri Bao·2025-06-26 23:00Group 1 - Micron's recent financial report and outlook are strong, with significant growth in the high bandwidth memory (HBM) market and increased outsourcing demand for backend testing and packaging [1] - Micron has significantly outsourced its HBM2 packaging to Taiwanese company Lianyi, which is expected to benefit from this market surge [1] - Lianyi is set to enter the HBM packaging market, with trial production expected in the second half of this year and substantial output anticipated next year [1] Group 2 - Micron emphasizes the growing importance of high-performance memory and storage for AI-driven innovations, enhancing interaction with customers and focusing resources on AI-centric product opportunities [2] - Micron reports that the yield and production of its 12-layer HBM3E are progressing well, with expectations to achieve a market share comparable to overall DRAM by the second half of the year [2] - Micron is shipping HBM to four major customers, with its 12-layer HBM3E 36GB already adopted by AMD's Instinct MI355X GPU platform [2]