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安徽向前丨合肥综保区:深耕“芯屏”赛道 工业产值十年增长超20倍
Ren Min Wang·2025-06-27 02:05

Core Viewpoint - The Hefei Comprehensive Bonded Zone has significantly boosted the development of the integrated circuit and new display industries in Anhui, achieving over 20 times growth in industrial output value since its establishment ten years ago [1][9]. Group 1: Industry Development - The new display industry in Hefei has rapidly advanced since the establishment of BOE Technology Group in 2008, but it faces challenges due to the lack of local driving chip enterprises [2]. - The Hefei government initiated a joint venture with Taiwan's Lianyi Crystal in 2015 to focus on the production of display panel driving chips, marking a strategic move to address the "screen without chip" issue [2]. - The Comprehensive Bonded Zone has attracted leading companies in the chip manufacturing sector, forming a preliminary closed loop for driving chip research and development [9]. Group 2: Policy and Operational Efficiency - The special tax and trade facilitation policies of the Comprehensive Bonded Zone have helped companies reduce costs and improve efficiency, enhancing product competitiveness [5]. - Innovative measures implemented by the local customs, such as on-site inspections for high-precision imported goods and "no-sense intelligent inspection" technology, have increased customs clearance efficiency by over 90% [5][9]. - The zone has established a rapid approval process for projects, exemplified by a record of 28 days from land acquisition to project commencement [5]. Group 3: Economic Impact - The industrial output value of the Comprehensive Bonded Zone is projected to reach 13.468 billion yuan in 2024, representing a growth of over 20 times since 2015, with integrated circuits accounting for over 80% of this output [9][12]. - In 2024, the strategic emerging industries in Anhui are expected to account for 43.6% of the industrial output, an increase of 0.7 percentage points [12].