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这家化合物半导体企业宣布完成A轮融资
Sou Hu Cai Jing·2025-06-27 06:16

Core Viewpoint - Fujian Fuliang Integrated Circuit Co., Ltd. has completed its Series A financing round, led by Xingzheng Innovation Capital, with participation from several industry partners. The funds will be used to expand production capacity, deepen research and development in compound semiconductor technology, and enhance the industrial chain collaboration [1][3]. Group 1: Company Overview - Fuliang Integrated was established in 2015 and is a state-controlled enterprise under Fujian Electronic Information Group, focusing on compound semiconductor wafer foundry services, covering second-generation (gallium arsenide) and third-generation (gallium nitride) semiconductor materials [3]. - The company currently operates the first mass production-level 6-inch gallium arsenide wafer production line in China, with a monthly capacity of 3,000 wafers, serving high-end applications in 5G communication, satellite communication, and national defense [3]. Group 2: Financing and Future Plans - The financing round aims to achieve three main objectives: expanding the existing gallium arsenide production line to increase monthly capacity to 6,000 wafers, initiating the construction of a gallium nitride wafer factory to enter the third-generation semiconductor market, and increasing R&D investment to develop higher frequency millimeter-wave chips and power devices [4]. - The investment from industry capital, including Zhaosheng Microelectronics, reflects recognition of Fuliang Integrated's technical strength and potential for collaboration in the gallium arsenide device foundry sector, particularly in the 5G RF chip area [4]. Group 3: Market Context - The compound semiconductor market is experiencing rapid growth, with increasing demand driven by the development of 5G, IoT, and electric vehicles. The penetration rate of gallium nitride in fast charging and electric vehicle applications is also rising quickly [4]. - Fuliang Integrated's financing will strengthen its production capacity and technical barriers, enhancing its competitiveness in the compound semiconductor foundry sector [4].